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G450C selects Ultratech as main tool supplier for 450mm anneal

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Leveraging on the success of its 300mm tool, the Ultratech laser spike annealing system will be used for 450mm manufacturing

Ultratech has announced that its laser spike annealing (LSA) technology has been selected as a primary 450mm millisecond annealing tool for the Global 450mm Consortium (G450C).

The G450C is headquartered at SUNY's College of Nanoscale Science and Engineering (CNSE) in Albany, New York. 

Utilised by leading IDMs and foundries around the globe, Ultratech's 300mm LSA system is now implemented in high-volume manufacturing of advanced logic devices from the 40- to 14-nm nodes. 

Built on the customisable Unity Platform, Ultratech says the LSA scanning system has fundamental advantages in uniformity and low-stress processing, which make it readily scalable to 450mm applications. 

Ultratech will deliver its 450mm LSA system for the G450C program's 450mm equipment line in late 2013.

G450C is a public-private partnership announced by New York Governor Andrew M. Cuomo in September 2011 to facilitate the 450mm wafer size transition. It is spearheaded by CNSE in partnership with Intel, IBM, GLOBALFOUNDRIES, Samsung and TSMC. 

The new 450mm cleanroom is located at CNSE's Albany NanoTech Complex within the NanoFab Xtension (NFX) expansion.

 Arthur W. Zafiropoulo, Chairman and Chief Executive Officer, states, "LSA's advantages of low pattern effects, full-wafer temperature control, and low-stress processing have been demonstrated in high-volume manufacturing at 300mm, and now we will carry those same advantages to the 450mm wafer size."

He explains that, "Because LSA is a scanning system, it is quite straightforward to scale the system to larger wafer sizes, as compared to full-wafer processing systems. Furthermore, we are now seeing an increase in LSA applications beyond the ultra-shallow junction formation, and we expect this trend to continue as we move to smaller device nodes where 450mm will be adopted."

" With our flexible and extendible LSA product line, Ultratech is strategically positioned to meet its customers' advanced processing needs. We are very excited to be a part of the G450C program at CNSE, which is leading the industry transition to 450mm technology as it ramps its 450mm manufacturing line. The 450mm LSA system is an example of our company's ongoing focus to provide cost-effective, leading-edge technology that enables competitive advantages for our global customers," concludes Zafiropoulo.

Paul Farrar Jr., CNSE Vice President for Manufacturing Innovation and General Manager of G450C, adds, "Under the leadership and vision of Governor Andrew Cuomo, New York is firmly established as the hub for the critical industry transition to 450mm wafer technology. We look forward to working closely with Ultratech and utilizing its capabilities to help enable the important transition to 450mm technology."

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