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Rudolph reveals new metrology suite for advanced packaging

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The new NSX metrology series includes application-specific configurations to address unique metrology requirements for wafer level packaging, 2.5D and 3DIC


Rudolph Technologies has released three new application-specific configurations of its NSX 320 Automated Macro Defect Inspection System.

The suite includes specially-designed configurations for wafer level packaging, 2.5D (interposer) and 3DICs using through-silicon via (TSV) as interconnects.

The first NSX 320 Metrology System for wafer level packaging shipped in June to a major outsourced assembly and test (OSAT) facility in Asia.

 

NSX 320 Automated Macro Defect Inspection System

"These new application-specific configurations of our established NSX 320 System are designed to address the emerging need for fast, precise three-dimensional (3D) measurements in the rapidly growing advanced packaging market sector," says Rajiv Roy, vice president of business development and director of back-end marketing at Rudolph Technologies.

"We have completed the integration of 3D measurement sensors, recently acquired from Tamar Technology, into the NSX System. Tamar's sensor technology is well recognized and widely used, and integrating it into the NSX 320 System adds critical capability required for enabling advanced packaging applications such as copper pillar bumping and TSV," he continues.

The NSX 320 wafer level packaging configuration is designed to measure thin remaining silicon thickness (RST), copper pillar height and solder bump height, surface topography and film thickness (polymers, photoresist, glass).

The advanced wafer level packaging configuration adds measurements of the wafer profile (warp and bow), total stack thickness and thick/thin RST (bonded wafer before and after grind).

The 3DIC configuration is capable of all the above measurements plus via depth, trench depth, bonded wafer TTV and adhesive layers.

Roy states, "3DIC device volume is forecasted to grow to $38.4 billion by 2017, according to Yole Développement. Rudolph is positioned to address the growth requirements for wafer level packaging, as well as 2.5D and other advanced packaging technologies, with industry-proven metrology tools that offer superior speed and measurement solutions."

 

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