+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Park's automated AFM classifies defects on substrates and disks

News


Park Systems has launched the Park NX-HDM. This is a fully automated automatic defect review and sub-angstrom surface roughness atomic force microscopy (AFM) system for device substrates and disk media.



                             Park NX-HDM

The company says this is the first metrology tool capable of providing this level of accuracy and automation. The NX-HDM system sets a new standard for the industry in automatic defect review AFM technology by increasing throughput by up to 1000 percent and offers a 30 percent higher success rate than the prior system. It analyses and identifies defects in all wafer sizes up to 150mm.

"For researchers working with hard disk media and other flat substrates, the process of identifying nanoscale defects is time consuming with conventional tools, hindering throughput. The Automatic Defect Review (ADR) speeds up and improves the way it identifies, scans and analyses defects in substrates and media," comments Sang-il Park, CEO and Chairman.

"Beta test runs with Park NX-HDM demonstrate a 10x increase in throughput for defect review in an automated process when compared with more traditional manual methods of defect review. Moreover, we perfected the remapping and defect identification algorithm, and the success rate of the new NX-HDM is 30 percent higher than its previous generation, XE-HDM."

Park NX-HDM for HDD, LED, solar, and general semiconductor device industries, speeds up the automatic defect review for media and substrates. The survey scan, zoom-in scan, and analysis of imaged defect types are automated with a wide range of automated optical inspection (AOI) tools.

What's more, 'True Non-Contact Mode', combined with one of the industry's lowest noise floors, provides accurate and reliable measurements for the sub-angstrom surface roughness of diverse media and substrates.

The unique Park dual servo system with two symmetric, low-noise position sensors are incorporated on each axis of the XY scanner to retain a high scan orthogonality for widescan ranges and sample sizes. The secondary sensor corrects and compensates for non-linear and non-planar positional errors caused by a single sensor.

"There has never been a metrology tool capable of providing accurate and reliable measurements for the sub-Angstrom roughness of the substrate surfaces," says Ryan Yoo, Vice President of Global Sales and Marketing. "By delivering the industry's lowest noise floor of less than 0.5 à…, Park NX-HDM can acquire accurate, repeatable, and reproducible sub-angstrom roughness measurements for the flattest substrates and media."

Suppliers to various industries are developing ultra-flat substrates to address the ever-increasing need for shrinking device dimensions. However, there has never been a metrology tool capable of providing accurate and reliable measurements for the sub-Angstrom roughness of this substrate surfaces.

Park NX-HDM combines the industry's lowest noise floor of less than 0.5 à… with Park's proprietary 'True Non-Contact' technology to create repeatable and reproducible sub-Angstrom roughness measurements without tip degradation. Scan size and scan speed are adjustable to match the user's needs in throughput and quality control.


Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: