IBM and austriamicrosystems have announced the signing of a development agreement for an advanced high-voltage (HV) complementary metal oxide semiconductor (CMOS) process technology to be used in a range of consumer, automotive, industrial and medical applications.
Avanex Corporation has announced that it completed the sale of 90 percent of its interest in its French subsidiary, Avanex France, including its Indium Phosphide (InP) and Gallium Arsenide (GaAs) semiconductor fabs, and its laser, terrestrial pump, submarine pump and Fiber Bragg Grating (FBG) product lines to Global Research Company, owned by Alexandre Krivine, and to the current management of Avanex France, Didier Sauvage.
Following the announcement of a collaborative effort with other corporations to help revitalize Lebanon, Intel Chairman Craig Barrett has dedicated new projects to improve education, healthcare and computer access to the Internet for its citizens.
Russia will pour over $1 billion into equipment for nanotechnology research over the next three years as it uses massive oil and gas export earnings to diversify an economy now heavily dependent on raw materials, First Deputy Prime Minister Sergei Ivanov said Wednesday.
Kyocera Corporation have announced plans to expand its annual solar module manufacturing capacity to 500 megawatts (MW) by the end of March 2011 — more than double its current annual capacity of 240MW — in response to global demand. The company has secured supply contracts with silicon producers to ensure the steady increase in production capacity.
Aixtron announced that a new Thomas Swan 3x2" Close Coupled Showerhead (CCS) epitaxy reactor has successfully been installed at the University of Braunschweig, Institute of Semiconductor Technology, Braunschweig, Germany and is in operation.
Inventory adjustments now underway in the IC industry, severe pricing pressures in the flash memory and MPU product segments, and the recent start of a major DRAM price collapse have caused IC Insights to lower its expectations for full-year 2007 worldwide IC market growth from 7% to 2%.
Cavendish Kinetics announced that National Semiconductor Corporation is working with the company to qualify its Nanomech embedded non-volatile memory technology for National's key analogue and mixed signal processes.
Qimonda announced its cooperation with Advantest to develop a hardware set-up for GDDR5 (Graphics Double Data Rate 5) testing. The cooperation aims for a cost efficient high volume test solution for GDDR5 graphics DRAM (dynamic random access memory) devices.
Taiwan's Interior Minister has recognised Rohm and Haas Electronic Materials, CMP Technologies Asia-Pacific Manufacturing and Technical Centre for its long-term commitment to the environment, as demonstrated by the design of this new facility.
Shanghai Hua Hong NEC Electronics Co. and Cypress Semiconductor Corp. have signed an agreement whereby Cypress will license its 0.13um SONOS (Silicon Oxide Nitride Oxide Silicon) embedded nonvolatile memory (NVM) technology to Hua Hong NEC.
Carl Zeiss SMT has launched its new generation of e-beam mask repair systems, the MeRiT MG 45. Carl Zeiss SMT provides the mask repair system matching the advanced requirements for the 45nm design node.