+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Rapidus joins imec’s Core Partner Program

News

Agreement with imec underscores importance of global collaboration and represents a key milestone in Japan’s pursuit to reclaim a leading position in the worldwide semiconductor ecosystem.

Imec and Rapidus, Japan’s newly founded chip manufacturer, have taken an important next step in setting up a long-term and sustainable collaboration in the domain of advanced semiconductor research, with Rapidus joining imec’s Core Partner Program.

During a Belgian economic delegation to Japan in late 2022, imec and Rapidus had already signed a Memorandum of Collaboration (MoC). This agreement was supported by both the Government of Flanders and Japan's Ministry of Economy, Trade, and Industry (METI), and affirmed the partners’ commitment to strengthening the ties between the semiconductor industries in Flanders and Japan.

“Rapidus is the cornerstone of Japan’s efforts to reclaim a leading position in the worldwide semiconductor ecosystem. Today, we are thrilled to announce that Rapidus has become an official member of imec's Core Partner Program,” stated Luc Van den hove, President and CEO of imec. “Through this partnership, we will help Rapidus research and develop the key building blocks necessary for the mass production of state-of-the-art 2-nanometer chip technology. Advanced chips like these can be used for 5G communications, quantum computing, data centers, autonomous vehicles, and digital smart cities.”

“This is yet another example of the fact that the chip industry’s strength lies in union, not division. While regions feel the need to strengthen their own strengths, real progress can only be achieved when they open up, connect their strengths, and pursue cross-border collaboration. It is a way of working that imec has held dear for almost forty years,” Van den hove added.

Imec's Core Partner Program has existed since 2005 and offers an exclusive, close-knit research and development partnership between the world's top foundries, IDMs, fabless and fablite companies, material suppliers, and equipment suppliers working in the field of (5-nanometer and beyond) IC process technologies. The program builds upon imec's cutting-edge cleanroom infrastructure, which houses the most advanced semiconductor manufacturing tools. This enables imec's partners to conduct research on technologies that are well ahead of industrial needs. Apart from Rapidus, imec’s Core Partner Program members include major industry players such as GlobalFoundries, Intel, Micron, Qualcomm, Samsung, SK Hynix, Sony Semiconductor Solutions, KIOXIA Corporation, TSMC and Western Digital.

Dr. Atsuyoshi Koike, President and CEO of Rapidus stated: “Joining imec's Core Partner Program is a significant milestone for us. It provides Rapidus with access to imec's advanced technologies, system solutions, state-of-the-art 300mm pilot line, and extensive partner network. International collaboration will be vital for us to attain our target of mass-producing 2-nanometer technology, and imec is a critical partner in achieving this goal. This agreement represents a decisive point in our endeavor to re-establish Japan's position in the semiconductor industry.”

Microcontroller for automotive battery management systems
Quantum breakthrough?
Inseto extends geographical reach
CHIPS for America announces $285 million funding opportunity
Veeco lands laser annealing order I
First-quarter semiconductor sales increase 15.2% year-to-year
FTD solutions unveils Water Management as a Service
Boosting smartphone performance
Report highlights opportunities for UK tech across Taiwan’s semiconductor sector
Waging a war on wastewater
Chasing the swarm: the new challenge for chip manufacturers
Chip, Chip, Hooray! Addressing connected semiconductor and chip growing pains
Lasers: a sustainable wafer heating solution
Semiconductor giants add $1.1 trillion to stock values
Trident IoT launches Taurus Z-Wave Series silicon
mechatronic systemtechnik unveils Fürnitz Technology Centre
Imec.xpand launches EUR 300m fund
Vishay extends Critical Manufacturing MES to semiconductor business
Keysight introduces testing capabilities to strengthen post-quantum cryptography
Conference spotlights the latest Microelectronics Packaging Technologies
OMNIVISION unveils Global Shutter Sensors
The challenge of decarbonizing the semiconductor industry and fulfilling chip demand
Trymax receives multi-system orders
CEA-Leti to report on latest packaging research
AI chip market to become a $300 billion industry
US DoD selects Intel Foundry for Phase Three of RAMP-C
CEA-Leti to coordinate 6G EU projects
Delivering RF Design Migration Flow to TSMC
Tektronix and EA Elektro-Automatik offer expanded power portfolio
83% of supply chains can’t respond to disruptions in 24 hours
CMC Microsystems and ventureLAB sign MoU
Wafer-level Integration Changes of ALD for 2D Materials
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: