Open-Silicon extends TSMC VCA partnership
Open-Silicon, a semiconductor design and manufacturing company, has extended its TSMC Value Chain Aggregator (VCA) program membership to include Israel.
Open-Silicon has been a TSMC partner in North America since its founding in 2003.
The firm has had a presence in Israel for almost ten years and is highly committed to its goal of providing best-in-class ASIC design services in the region.
Through its collaborative relationship with TSMC, Open-Silicon can build on its existing relationships in Israel and continue to provide front-end design services such as ASIC architecture, RTL design and design verification, as well as physical design and complete manufacturing services
"We're proud that TSMC has selected Open-Silicon as a VCA member in Israel," comments Naveed Sherwani, president and CEO of Open-Silicon. "Through our collaborative relationship with TSMC we can more easily meet our goal of delivering customer-centric solutions, operational excellence and high customer satisfaction."
"Building on Open-Silicon's track record in Israel, TSMC is pleased to welcome Open-Silicon to the VCA program in Israel where Open-Silicon leverages its value-added services, local presence and design expertise to best serve emerging and system companies. We look forward to extending the VCA service reach with Open-Silicon for Israeli customers," says Maria Marced, President of TSMC Europe BV.
TSMC's VCA program was developed to integrate design enablement building blocks within TSMC's Open Innovation Platform (OIP) and provide specific services at each link in the IC value chain, including IP development, design backend, wafer manufacturing, assembly and testing.
Open-Silicon is a supplier and developer of customer-specific products (CSPs), provides ASICs, platforms, concept-to-parts development, customised IP, low-effort derivative design, and manufacturing solutions.
The firm's customers benefit from global engineering including an ARM Technology Centre of Excellence, advanced SerDes integration, 2.5D interposer-based package engineering, experienced architects, leading-edge physical design methodology, and embedded software development.
