+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

USI enhances lab scale coating system

News


Ultrasonic Systems (USI) has made several improvements to its Prism BT Benchtop precision spray coating system.

The Prism BT Benchtop uses USI's proprietary, nozzle-less ultrasonic spray head technology for the thin, uniform application of a variety of coatings, inks and suspensions used in the fuel cell, display, medical device, solar cell, printed circuit board electronics assembly and semiconductor manufacturing processes. 

The Prism BT Benchtop system has a high speed X-Y gantry allowing for process speeds of up to 500mm per second, enabling customers to apply very thin coating layers down to 10-20nm. New software has also been released, featuring a next generation graphical user interface. 

Designed for lab scale and research and development coating requirements, the Prism BT Benchtop system features a usable spray area of up to 400mm x 400mm. 

Liquid delivery system options include USI's Precision Metering Pump with servo motor liquid flow control and integrated liquid stirring, a research grade syringe pump and pressurized reservoirs of various sizes. 

Other system options include a substrate heater with vacuum hold and 90 degree pneumatic spray head rotation. 

"We are pleased to announce these improvements to our Prism BT Benchtop system as we continue our commitment to offering coating solutions that meet the specific application requirements of our customers," comments Stuart Erickson, President of Ultrasonic Systems. 

 


Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: