SEMI: Material revenues for packaging exceed wafer fabrication
The global semiconductor materials market decreased 2 percent in 2012 compared to 2011 while worldwide semiconductor revenues declined 3 percent.
Revenues of $47.11 mark the first decline in the semiconductor materials market in three years.
Total wafer fabrication materials and packaging materials were $23.38 billion and $23.74 billion, respectively. Comparable revenues for these segments in 2011 were $24.22 billion for wafer fabrication materials and $23.62 billion for packaging materials.
2012 is the first time packaging materials revenues exceeded wafer fabrication materials revenues. A substantial decline in silicon revenue contributed to the year-over-year decrease to the total semiconductor materials market.
For the third year in a row, Taiwan is the largest consumer of semiconductor materials with record spending of $10.32 billion due to its large foundry and advanced packaging base. This was an increase of 2 percent compared to 2011.
Materials markets in China and South Korea also experienced increases in 2012, benefiting from strength in packaging materials. While the Chinese market increased by 4 percent, Korea increased by a mere 1 percent.
The materials market in Japan contracted 7 percent, with markets also contracting in Europe (by 8 percent), North America (by 2 percent), and the Rest of World (by 1 percent). Note that the ROW region is defined as Singapore, Malaysia, Philippines, other areas of Southeast Asia and smaller global markets.
The data depicted at the top of this story is compiled from SEMI April 2013 data. Note that figures may not add due to rounding.
The Material Market Data Subscription (MMDS) from SEMI provides current revenue data along with seven years of historical data and a two-year forecast.
