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Wednesday 3rd December 2003
SEMI issued its Capital Equipment Consensus Forecast. For this year, sales are expected to reach $21.3bn, up 8.20% from last year’s $19.75. More speculatively, the consensus gives figures for 2004-2006: $29.62bn (+38.61%), $35.00bn (+18.16%) and $32.68bn (-6.63%).
Wednesday 3rd December 2003
ASML claims the industry's first immersion lithography system – the Twinscan XT:1250i – a 0.85 numerical aperture (NA), 193nm pre-production lithography scanner. ASML has already booked a customer order from TSMC for the XT:1250i with initial delivery set for Q3 2004.
Monday 1st December 2003
Communicant, the German mixed-signal foundry development, has declared bankruptcy ("stille Liquidation") on Friday November 28, 2003.
Friday 28th November 2003
Scientists at Philips Research have made organic field-effect transistors that conduct both positive holes and negative electrons within a single sheet of material. The company believes that the discovery enables the design of robust digital circuits with low power dissipation and high product yield. Philips scientist Dr Eduard Meijer (pictured) recently received the Else Kooi award for his PhD research that led to the discovery.
Friday 28th November 2003
Communicant, the German mixed-signal foundry development, has declared bankruptcy today (Friday November 28, 2003).
Wednesday 26th November 2003
German microsystem foundry microFAB Bremen has ordered a complete micro-electro-mechanical system (MEMS) process line from SUSS MicroTec. Some of microFAB's key products include high quality MEMS based silicon microphones for hearing aids and mobile phones.
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Wednesday 26th November 2003
Intel reports that it has built fully functional 4Mbit static random access memory (SRAM) chips using 65nm process technology – the company’s next generation high-volume semiconductor manufacturing process. Intel says it is on track to be the first put this process into production in 2005 using 300mm wafers.
Wednesday 26th November 2003
Philips Electronics and Jilin Sino-Microelectronics (JSMC) in China established a joint venture to develop, design and manufacture bipolar power products to be marketed and sold by the parent companies. Financial details were not disclosed.
Wednesday 26th November 2003
Japanese company Showa Denko (SDK) will open a resident representative's office in Moscow in January 2004 to make full use of R&D resources in Russia.
Wednesday 26th November 2003
Soisic, a semiconductor intellectual property (SIP) company specialising in silicon on insulator (SOI) designs, has completed series-B funding round of EUR12.5mn led by Atlas Venture. The round also included co-investments from KT Venture and all existing investors. These include CEA Valorisation SA, a subsidiary of the Commissariat a l'Energie Atomique (CEA), the French public technological research organisation and SOI wafer manufacturer Soitec.
Wednesday 26th November 2003
KLA-Tencor and Soitec have entered a joint programme to improve the quality, yield and cost of production of the silicon on insulator (SOI) wafers used in high-performance, low-power-consumption IC applications.
Wednesday 26th November 2003
Tokyo Electron (TEL) and ASML Holding agreed to enhance litho-cluster productivity and process performance through joint development programmes. Multiple tool exchanges in early 2004 will be used to facilitate customer demonstrations in Japan, the Netherlands and the USA. Litho-cluster describes the linking of coater/developer and lithography systems used in semiconductor manufacturing.
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Wednesday 26th November 2003
Spanish researchers have created a new ultra-light transparent magnetic material (Applied Physics Letters, Vol.82, pp.4307-4309). The scientists come from the Universitat Autonoma de Barcelona (UAB), the Institut de Cienca de Materials de Barcelona (ICMAB-CSIC) and the Universidad de Zaragoza.
Wednesday 26th November 2003
The EUREKA project E! 2259 VSI has developed 3-D chips or vertical system integration (VSI). The contributors see benefits for chip cards (smartcards) to secure information or e-money against hackers.
Wednesday 26th November 2003
ASM International has shipped a Levitor 4000 rapid thermal processing (RTP) system for 200mm wafers to a "leading device maker in Europe". The European customer will use the tool to develop implant anneals for 90nm processing and NiSi annealing applications in the 200-550C temperature range for future technology nodes.
Friday 21st November 2003
BTG has acquired the exclusive rights to commercialise Strain-Compensated Multiple Quantum Well vertical cavity surface emitting lasers (VCSELs) from the Cornell Research Foundation in New York state.
Thursday 20th November 2003
Japanese company Showa Denko (SDK) plans to market in early 2004 a hexafluoro-1,3-butadiene (C4F6) dry etching gas it has developed in Russia. C4F6 enables dry etching at a line width of as narrow as 90nm or less. SDK will import crude C4F6 produced in commercial quantities in Russia for purification at SDK's Kawasaki plant. SDK will then provide the quality assured product to the market.
Thursday 20th November 2003
International SEMATECH (ISMT) engineers have qualified a porous, ultra low-k material for dual damascene copper processing at 130nm feature sizes, on 300mm wafers, using 193nm lithography.
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Thursday 20th November 2003
The United States comes 11th in a global index ranking information and communication and technology (ICT) access made by the International Telecommunication Union (ITU). The index includes assessments of infrastructure, affordability, population knowledge/education, quality of service and usage.
Thursday 20th November 2003
CSD Epitaxy delivered an EpiPro epitaxial processing production system to Polish company Cemat Silicon, a supplier of silicon epitaxial wafers. The delivery represents a repeat order by Cemat for the EpiPro 5000 system. CSD Epitaxy acquired the Gemini and EpiPro product lines from Mattson Technology earlier this year. CSD Epitaxy has manufacturing headquarters in California.
Thursday 20th November 2003
AMD has broken ground on a 300mm manufacturing facility in Germany. AMD Fab 36 will be part of AMD Dresden Fab 36 LLC & Co. KG and will be located in Dresden next to AMD’s Fab 30, a 200mm production site. The 300mm facility is expected to be in volume production in 2006, employing 1000 people, mostly skilled engineers and technicians.
Thursday 20th November 2003
ON Semiconductor plans to consolidate more of its assembly and test operations at its site in Seremban, Malaysia, discontinuing back-end activities in Roznov, Czech Republic. The Rosnov tools will be moved to Seremban. ON Semiconductor plans to maintain its front-end manufacturing and design centre operations at Roznov, where it has significant ties to technical universities in the Czech Republic and Slovakia.
Thursday 20th November 2003
Researchers at the Sandia US national laboratory have developed record-breaking ultraviolet light emitting diodes (UV LEDs). Two separate devices have been produced that emit light at 290nm and 275nm. The 290nm device has an output power of 1.3mW in a continuous wave (CW) mode, while the shorter wavelength part produces 0.4mW.
Wednesday 19th November 2003
Europe’s ASML and Japan’s Dainippon Screen Manufacturing have agreed to jointly develop seamless litho-clustering methods. The term "litho-cluster" describes the linking of track and lithography systems. The companies plan to instal Dainippon Screen’s track systems in the ASML Development Laboratory in Veldhoven, the Netherlands.

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