Loading...
News Article

Lynceus and NXP Semiconductors partner

News

Lynceus and NXP Semiconductors recently presented a case study on “Qualifying AI for Automotive Production”.

Given at the Fab Owners Alliance (FOA) Q1 Collaborative Forum in Phoenix, Ariz, the presentation covered the importance of qualifying AI for production deployment, specifically for automotive-grade production.

The shift towards electric vehicles and autonomous driving means cars are increasingly packed with highly critical electronic components. Automotive chip manufacturers need to adapt by producing more reliably, while optimizing asset spending in a challenging market environment.

AI can in principle help improve yield and production capacity in existing fabs but to this date has not been adopted at full scale. The industry misses a robust qualification and introduction process, able to bridge the gap between a performant predictive model and a fully functioning AI production solution.

“To this day, AI solutions have not met the robustness and reliability standards of automotive-grade production, and the industry is missing a qualification framework to validate an AI solution that is ready for deployment in an automotive fab,” said David Meyer, CEO of Lynceus. “In collaboration with NXP, we are the first to fully qualify AI for automotive-grade production, and we have developed an actionable framework that can be repurposed for any AI application,” he added.

The presentation touched on a four-step playbook covering:

● Who needs to be involved and how

● What is a reliable model

● What supporting infrastructure is required

● How to assess associated manufacturing risks and opportunities

“Successfully deploying AI in a high-value manufacturing environment, such as a semiconductor fab, by focusing on predictive performance alone is not enough. Building a comprehensive qualification case evidencing the expected impact on manufacturing performance, the robustness of the system and the feasibility of scaling is a critical and often neglected step to fostering large scale adoption of AI,” Meyer stated.

ZEISS launches Crossbeam 550 Samplefab FIB-SEM
Critical Manufacturing brings highly advanced MES solution to SEMICON Europa
Infineon at electronica 2024: Solutions for decarbonisation and digitalisation
Infineon unveils 'world’s thinnest' silicon power wafer
Sunlit Chemical expands global reach with US facility opening in Phoenix
Semiconductor patent applications up 22% globally to 81,000 a year
Promoting collaboration and novel IC design technologies
EV Group announces board expansion In light of unabated growth
MIT team takes a major step toward fully 3D-printed active electronics
TSMC recognises Ansys
Quantum foundry nears completion
Global silicon wafer shipments to remain soft in 2024
DELO introduces UV-approach for fan-out wafer-level packaging
New 10-point guide to humidity control in cleanrooms
High memory bandwidth in the spotlight
Improved materials for microchip interconnections
SEMICON Europa 2024 to explore innovations in Advanced Packaging and Fab Management
SEMIExpo Vietnam 2024 heralds Vietnam’s position as 'dynamic new player'
Next Gen 3D X-Ray Inspection for Advanced Packaging: To see better. Faster. More.
New strategic collaboration between FRAMOS and NXP Semiconductors
Splitting hairs to ten to the power of four
TANAKA introduces “TK-SK” Palladium alloy for test equipment
Rebellions collaborates on next-gen AI computing chiplet technology
Semiconductor giants add $2.7 trillion to their stock values
Test early and test often
Semiconductors: Unstoppable growth in a billion-dollar market
Sustainable cleaning solutions for a greener microelectronics industry
Why the mask world is moving to curvilinear
Beyond AOI: An AI-driven revolution in visual inspection
Xscape Photonics raises $44 million Series A
CMOS sensors for niche vision applications
Emphasis on AI applications
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: