Loading...
News Article

ASML and Eindhoven University of Technology strengthen longstanding collaboration

News

Stronger partnership through extended joint research programs and collaborative facilities.

ASML has detailed a new phase in its longstanding partnership with Eindhoven University of Technology (TU/e), the leading academic institution in Brainport Eindhoven. This includes a jointly defined research program, the construction of a new ASML research facility on the TU/e campus, including the creation of a state-of-the-art cleanroom.

The two parties signed a memorandum of understanding to jointly develop a 10-year strategic research road map in the fields of plasma physics, artificial intelligence, mechatronics and semiconductor lithography. The TU/e and ASML will invest substantially and equally in the joint program. The newly created program will together create up to 40 PhD positions yearly, for which the TU/e will recruit internationally renowned top scientific talents. In turn, ASML will supply its top engineers as hybrid teachers in these areas and will increase the number of internships it hosts. This approach will scale up the already proven and longstanding close collaboration between the TU/e and ASML, bringing together the best in science and engineering in Brainport Eindhoven.

Additionally, ASML announced that TU/e is in the process of granting a long-term lease on the TU/e campus to realize a new ASML research facility in the coming years, where the company intends to co-locate the many competences of its Research team. The new facility will also have shared work spaces, meeting rooms, research labs and a state-of-the-art cleanroom facility. The new cleanroom facility will also include analytical and production equipment in an open-access research laboratory that is also available to TU/e, to other research centers and industrial partners. This collaborative cleanroom space will enable growth and synergy across academic research fields of mutual interest such as photonics, quantum computing, nano materials and chip manufacturing. In addition the facility will include substantial cleanroom space dedicated to TU/e exclusively. This space will be rented long-term to TU/e, for fundamental research in the same and related areas.

The realization of the envisioned facility involves an estimated investment of several hundred million euros. It is intended to provide space for more than five hundred researchers, including several hundred ASML employees.

Jos Benschop, Corporate Vice President Technology at ASML said, “Our relationship with Eindhoven University of Technology goes back to the earliest days of ASML. Our collaboration is based on a shared commitment to create meaningful innovation for society by bridging fundamental science and industrial engineering. This next step in our partnership shapes a brighter future for the Brainport region.”

Robert-Jan Smits, President of the Executive Board of the Eindhoven University of Technology, said, “We are very happy to strengthen our collaboration with ASML, one of the world’s leading technology companies and a R&D powerhouse. This collaboration is in the university’s DNA and in line with its strategy. We are an international top university with strong roots in Brainport Eindhoven. We have a leading position in industrial collaboration that we want to expand further. This provides enormous opportunities for the university, for scientists and for students. It will also help us attract talented researchers from around the world, which is crucially important for Brainport Eindhoven, The Netherlands and Europe.”

ZEISS launches Crossbeam 550 Samplefab FIB-SEM
Critical Manufacturing brings highly advanced MES solution to SEMICON Europa
Infineon at electronica 2024: Solutions for decarbonisation and digitalisation
Infineon unveils 'world’s thinnest' silicon power wafer
Sunlit Chemical expands global reach with US facility opening in Phoenix
Semiconductor patent applications up 22% globally to 81,000 a year
Promoting collaboration and novel IC design technologies
EV Group announces board expansion In light of unabated growth
MIT team takes a major step toward fully 3D-printed active electronics
TSMC recognises Ansys
Quantum foundry nears completion
Global silicon wafer shipments to remain soft in 2024
DELO introduces UV-approach for fan-out wafer-level packaging
New 10-point guide to humidity control in cleanrooms
High memory bandwidth in the spotlight
Improved materials for microchip interconnections
SEMICON Europa 2024 to explore innovations in Advanced Packaging and Fab Management
SEMIExpo Vietnam 2024 heralds Vietnam’s position as 'dynamic new player'
Next Gen 3D X-Ray Inspection for Advanced Packaging: To see better. Faster. More.
New strategic collaboration between FRAMOS and NXP Semiconductors
Splitting hairs to ten to the power of four
TANAKA introduces “TK-SK” Palladium alloy for test equipment
Rebellions collaborates on next-gen AI computing chiplet technology
Semiconductor giants add $2.7 trillion to their stock values
Test early and test often
Semiconductors: Unstoppable growth in a billion-dollar market
Sustainable cleaning solutions for a greener microelectronics industry
Why the mask world is moving to curvilinear
Beyond AOI: An AI-driven revolution in visual inspection
Xscape Photonics raises $44 million Series A
CMOS sensors for niche vision applications
Emphasis on AI applications
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: