Oerlikon Leybold Vacuum offers a broad range of advanced vacuum solutions for use in manufacturing and analytical processes, as well as for research purposes. The Segment’s core capabilities centre on the development of application- and customer-specific systems for the creation of vacuums and extraction of processing gases. Areas of application are to be found in the coating of microchips, CDs and DVDs during production, as well as in the manufacturing of optical glass that can only be coated in a vacuum.
Fujitsu Limited (Fujitsu), Fujitsu Microelectronics of America, Inc. (FMA), and Jazz Semiconductor, Inc. (Jazz announced that they will work together to manufacture System-on-Chip (SoC) products for RFCMOS devices.
Dialog Semiconductor Plc and E Ink Corporation have both announced the launch of new products resulting from a strategic partnership that will open up new markets for electronic paper displays (EPD). ;;
In a move that signals a firm and ongoing commitment to future technology development, IBM and its joint-development alliance partners Infineon Technologies and Freescale Semiconductor along with its Common Platform technology partners Chartered Semiconductor Manufacturing and Samsung Electronics, have signed a series of semiconductor process development and manufacturing agreements.
Inficon has been awarded an order of USD 2.3 million from a major memory chip manufacturer in Taiwan for multiple in situ metrology sensors, FabGuard advanced process software, and high performance leak detectors.
Micrologic has announced that it has joined the Cadence Connections program of Cadence Design Systems. The program promotes open interoperability between Cadence technologies and other companies' design tools.
AMI Semiconductor was selected by Broadcom as a design and technology partner for two new highly-integrated power sourcing equipment (PSE) controllers for use in Broadcom's Power over Ethernet (PoE) products.
Semiconductor Research Corporation (SRC) has joined with the National Science Foundation (NSF) to announce funding of $2M in grants for nanoelectronics research at six major NSF centres across ten U.S. universities.
QUALCOMM MEMS Technologies and Ubixon Co have announced an agreement to integrate QUALCOMM's Micro-Electro-Mechanical Systems (MEMS) displays into the next generation of Ubixon Bluetooth stereo headset products.