Loading...
News Article

Revolutionising Silicon MEMS Technology With CMOS

News
A new Nasiri fabrication platform should broaden the MEMS developer community

InvenSense, a pioneer in MEMs technology says it is using a new game-changing strategy.


The company is offering its proprietary MEMS fabrication process for use by all MEMS developers on a limited licensing basis.


One of the processes known as NF-Shuttle, enables emerging MEMS developers to focus on innovation rather than time consuming and costly specialised fabrication development.


"At InvenSense, we are committed to seeing the proliferation of MEMS products on our proprietary fabrication platform not only in inertial sensors but also in resonators, microphones, switches, pressure sensors, RF tuners, etc.," points out Steve Nasiri founder and CEO of InvenSense.


"We have found there are many companies and universities that have brilliant ideas yet they need to spend as much as 60 to 80 percent of their time and development resources on MEMS-related fabrication due to lack of any viable off-the-shelf processes. With our platform it is now possible to bring innovative MEMS products to market much faster and at significantly lower costs."


The InvenSense NF-Shuttle is a silicon CMOS-MEMS platform where mask costs are split amongst multiple users as they can purchase "seats" on the same mask. The company says this approach reduces production costs for participants to a fraction of the total and thus provides a greater opportunity to verify their advanced designs and prototypes in silicon.


The initial shuttle test run which took place in January was offered to selected participants from University of California Berkeley with U.C Davis, Stanford University, and a few other institutions.


The short turn-around time, cost and results, observed by the aforementioned institutions have secured space on InvenSense's next two shuttles. InvenSense's second shuttle is scheduled for May 30th, with an increased number of selected participants. The company is opening a third shuttle to a broader audience and is taking orders now. The third shuttle is expected for takeoff on December 5, 2012.


The InvenSense NF Platform has been used to produce over 200 million MEMS units to date. The disruptive, patented Platform is able to combine MEMS on CMOS (or CMOS-MEMS) in a small, cost effective standard package resulting in significant performance, reliability, integration and cost benefits.


Combining a MEMS wafer with an industry standard CMOS wafer allows InvenSense to reduce the number of MEMS manufacturing steps, perform wafer-level testing, and use chip-scale packaging. This reduces back-end costs of packaging and testing and improves overall yield.

Lam Research introduces collaborative robot
PlayNitride selects Veeco’s Lumina MOCVD system
Marvell introduces 'breakthrough' custom HBM compute architecture
Chiplet Summit features latest chip design technology
Silicon photonics: accelerating growth in the race for high-speed optical interconnects
CCD-in-CMOS technology enables ultra-fast burst mode imaging
2025 6G A look forward
Critical Manufacturing climbs Deloitte’s Technology Fast 50
Semiconductors: The most important thing you probably know the least about
Imec and partners unveil SWIR sensor with lead-free quantum dot photodiodes
Lattice introduces small and mid-range FPGA offerings
SEMI and SMT inspection solutions at NEPCON Japan 2025
Nordic Semiconductor and Kigen demonstrate Remote SIM Provisioning for Massive IoT
Spirent collaborates with Siemens
Quobly forges strategic collaboration with STMicroelectronics
New standards in pressure measurement systems for the semiconductor industry
IBM delivers optics breakthrough
Semiconductor equipment sales to reach $139 Billion in 2026
Marvell introduces 1.6 Tbps LPO Chipset
ACM research strengthens Atomic Layer Deposition portfolio
CEA-Leti demonstrates embedded FeRAM platform compatible with 22nm FD-SOI node
Lattice introduces small and mid-range FPGA offerings
Solace unlocks full potential of event-driven integration
Advantest to showcase latest test solutions at SEMICON Japan 2024
CEA-Leti device integrates light sensing and modulation
Nordic launches Thingy:91 X prototyping platform for cellular IoT and Wi-Fi locationing
Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer
High-precision SMU
Powering India’s energy future
China’s Nvidia probe puts global investors ‘on notice’
POET Technologies appoints new director
Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: