CEA-Leti announces launch of FAMES pilot line as part of EU Chips Act initiative

Jean-René Lèquepeys, CTO of CEA-Leti, explains how the pilot line ecosystem of research and commercial partners will develop five new sets of technologies: FD-SOI (with two new generation nodes at 10nm and 7nm), several types of embedded non-volatile memories, radio-frequency components, two 3D integration options (heterogeneous integration and sequential integration), and small inductors to develop DC-DC converters for Power Management Integrated Circuits (PMIC).