Accelerating mechanical stress simulation for 3D-IC reliability in the cloud

Marc Swinnen, Senior Principal Product Marketing Manager at Ansys, discusses the company’s recent collaboration with TSMC and Microsoft to develop a joint solution which provides a high-capacity cloud solution for analysing the mechanical stresses in 2.5D/3D-IC multi-die systems, which lets joint customers avoid field failures and extends product lifetime and reliability.

This video is part of a collection: SiS Issue 2 - Part 3