VIDEO
Wafer bonding moves front and centre
Video Summary
Thomas Uhrmann, director of business development, EV Group, discusses why and how wafer bonding is no longer simply a back-end integration process but now a front-end manufacturing process as well, how the company is working with lithography and other technology partners as part of this new focus, and also outlines the work being done on advanced packaging and future scaling collaboration.
This video is part of a collection: SiS Issue 7 - Part 4
