+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

CNR-IMM Italy uses SENTECH SI PEALD system for new high-k materials


The Institute for Microelectronics and Microsystems (CNR-IMM/1/) in Catania, Italy is using a SENTECH SI PEALD LL tool with an 8-inch wafer configuration. The research Institute belongs to the Physics and Matter Technologies Department (DSFTM) of the National Research Council of Italy (CNR), and has its headquarters in Catania. The integration of novel high-k gate dielectrics and passivating layers on devices based on Gallium Nitride and other wide band gap semiconductors is investigated using SENTECH PEALD tool. SENTECH proprietary true remote CCP plasma source is especially suited for such low temperature and no damage applications. The special design of the plasma source only allows radicals to reach the wafer surface. High energy photons and ions are completely blocked.

Contextually, IMM and SENTECH have signed a Joint Development Agreement with the objective of the development and characterization of laminated layers. The use of alternative high-k materials favors downsizing of the devices while keeping constant their capacitance values and reducing the leakage current density. In particular, the growth of Al2O3-HfO2 laminated layers is among the most often used combinations for such applications.

"The SENTECH SI PEALD LL reactor is a high performance and flexible system, allowing the production of several high quality dielectric thin films, whose physical properties can be tailored upon changing their chemical composition.", says Dr Raffaella Lo Nigro who is the scientist in charge of the SI PEALD LL tool and of cooperation with SENTECH. Dr Lo Nigro has wide ranging expertise in the synthesis of binary and complex thin films by chemical

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: