+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

X-FAB Strengthens Position in High Volume SiC production

News

Advancing semiconductor technology, X-FAB Silicon Foundries has reached another important milestone in the establishing of the world's first semiconductor foundry to support 6-inch silicon carbide (SiC) production. The company, in collaboration with the U.S. Department of Energy (DOE) and the PowerAmerica Institute, has just deployed a high temperature implanter at its facility in Lubbock, Texas.

Leveraging its existing, high volume silicon production lines, X-FAB is in the unique position that it can offer the economies of scale needed to encourage widespread adoption of power devices based on SiC substrates. As a result it is fully equipped to present the industry with a responsive, market scalable and cost effective manufacturing capability. X-FAB's SiC offering also draws on the company's long standing reputation for serving the most challenging of applications. It has been extensively predicted that the automotive and industrial sectors are going to be responsible for driving SiC uptake, and this is where X-FAB has decades' worth of valuable insight and experience, delivering numerous key technologies with high degrees of differentiation.

 "Through the installation and qualification of this high temperature implanter we are now ready to support our SiC customers as they move from prototyping to volume production in 2017. This means that they will be right at the forefront of the transition of SiC to 6-inch wafers," states Andy Wilson, X-FAB Texas' Director of Strategic Business Development. "The ongoing backing of the DOE and PowerAmerica has proved instrumental in getting us to this next stage, helping X-FAB to make a major impact in relation to this exciting new technology and ensuring that its potential is fully realized."

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: