+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

MegaChips, Omni Design, collaborate on low-power analog front end (AFE) chips


MegaChips Corporation, a global semiconductor company specializing in ASICs and Application Specific Standard products (ASSPs), and Omni Design Technologies, a provider of ultra-low power semiconductor IP cores, has announced a partnership for the development of low-power analog front end (AFE) chips. This partnership brings together two industry leaders with the joint purpose of offering differentiated solutions and products to enable next-generation home and access networks and industrial automation.

"Both MegaChips and Omni Design offer unique technology for the communications market," said Masahiro Konishi, general manager at MegaChips Corporation. "By partnering with Omni Design Technologies, an industry leader in semiconductor IP cores, we can continue to develop timely, original AFE chips designed to give our customers a competitive edge."

Dr. Kush Gulati, president and CEO of Omni Design Technologies, said: "MegaChips has an outstanding reputation for providing cutting-edge system solutions for its customers. We are delighted to partner with them to develop high-performance, ultra-low power AFEs incorporating high-resolution and high-speed Analog-to-Digital Converters (ADCs) based on our revolutionary SWIFT technology."

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: