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SCREEN Semiconductor, Leti, collaborate on Laser Anneal Technology


SCREEN Semiconductor Solutions Co., Ltd. (SCREEN) and Leti, a CEA Tech institute, have announced they have stepped up their collaboration with the installation at Leti's site of a nanosecond-scale UV laser anneal LT-3100 system to be delivered by Laser Systems and Solutions of Europe (LASSE), SCREEN's subsidiary based in France.

"The introduction of SCREEN's nanosecond-scale UV laser anneal tool in Leti's leading-edge, pre-industrial equipment infrastructure will open new innovation opportunities for current and future technology being developed on site," said Leti CEO Marie Semeria. "With SOI, CoolCubeTM and nanowire technologies development, we are facing increased challenges in developing new material property and ultra-thin-film modification with minimal thermal impact. Leveraging the LT-3100 system will enable solutions for technology breakthroughs that will eventually lead to the development of practical demonstrators for industry."

"Following a long history of successful joint developments with Leti, we are very excited by the opportunity to bring our laser technology to Leti's ecosystem to support "˜More than Moore', IoT and future innovation technology requirements," said Tadahiro Suhara, president of SCREEN Semiconductor Solutions. "In addition to the collaboration activities, we will use Leti's state-of-the-art infrastructure to operate our LASSE European demo lab, giving our customers unprecedented demonstration infrastructure capability. We expect to showcase the innovation value that our nanosecond-scale UV laser-equipment technology and resources bring to advance semiconductor process development in multiple fields of research and development as supported by Leti."

The Laser tool is expected to be fully operational in the first half of 2017 and will support multiple wafer size requirements to meet the different needs of Leti's laboratories.

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