Info
Info
News Article

ON Semiconductor Introduces Touch, Proximity Sensing Solution

News

ON Semiconductor has introduced a new touch/proximity sensing solution that combines performance, cost-effectiveness and convenience in a single chip. The LC717A30UJ high dynamic range capacitance-to-digital converter uses mutual capacitance to detect changes in capacitance down to femtofarad (fF) levels. Parasitic capacitance cancellation raises the detector sensitivity, while its built-in noise rejection mechanism combats the effects of electromagnetic interference (EMI).The eight capacitance-sensing input channels make the LC717A30UJ highly optimized for use in systems where an array of switches is required. The device includes an integrated multiplexer for input channel selection, analog-to-digital converter, dual-stage amplifier that determines capacitance changes plus outputs analog amplitude values, system clock, power-on reset circuit, and all the necessary control logic to create a total solution. Both I2C and SPI interfaces are selectable based on the system application needs.

As the device's sensitivity has a range of 150 millimetres (mm) - beyond the scope of any competing device on the market "“ its higher sensitivity enables gesture motions as well as offering conventional touch functionality, thereby enhancing users' control options to address a wide range of application scenarios. In addition, it is capable of operating with an airgap between the sensor/PCB and the protective cover - so engineers can eliminate the inclusion of a light guide from the assembly and reduce overall complexity. This device also includes an integrated automatic calibration function which optimizes and self-calibrates total capacitance according to electrode, line capacitance, and surrounding environment, thus significantly accelerating system development cycle time as well as robustness in the field.

The LC717A30UJ delivers rapid responsiveness, with a measurement time of 16 milliseconds (ms) for its 8 sensing channels and runs off a +2.6 volt (V) to +5.5 V supply with a low-power standby mode of 0.1 (uA). The high degree of integration means that minimal external components are required, thereby further reducing the bill of materials. To support the needs of automotive applications such as vehicle entry systems and dashboard controls, the device is AEC-Q100 compliant. With its high integration level and wide dynamic range, it can also be employed in a range of touch or gesture human interfaces in industrial and consumer end products such as induction cookers, refrigerators, home entertainment systems, building automation equipment, industrial equipment, and lighting controls.

"As we all know, touch technology has witnessed widespread uptake within the consumer electronics sector over the course of the last decade. Now there are an ever-increasing number of opportunities for its utilization in various non consumer sectors," said Ikuya Kawasaki, General Manager of the Intelligent Power Solutions Group at ON Semiconductor. "This new device possesses the key attributes needed to address these demands, by providing a robust, simple to deploy solution that successfully combines low price and superior performance."



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
DISCO's Completion Of New Building At Nagano Works Chino Plant
Changes In The Management Board Of 3D-Micromac AG
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
Will Future Soldiers Be Made Of Semiconductor?
ITRI And DuPont Inaugurate Semiconductor Materials Lab
EV Group Establishes State-of-the-art Customer Training Facility
K-Space Offers A New Accessory For Their In Situ Metrology Tools
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
Cadence Announces $5M Endowment To Advance Research
AP&S Expands Management At Beginning Of 2021
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
Panasonic Microelectronics Web Seminar
TEL Introduces Episode UL As The Next Generation Etch Platform
ASML Reports €14.0 Billion Net Sales
SUSS MicroTec Opens New Production Facility In Taiwan
New Plant To Manufacture Graphene Electronics
Onto Innovation Announces New Inspection Platform

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event