Info
Info
News Article

Amkor Technology To Acquire NANIUM

News

Amkor Technology and NANIUM S.A. have announced that they have entered into a definitive agreement for Amkor to acquire NANIUM, a world class provider of wafer-level fan-out (WLFO) semiconductor packaging solutions. Terms of the transaction were not disclosed.

The acquisition of NANIUM will strengthen Amkor's position in the fast growing market of wafer-level packaging for smartphones, tablets and other applications. NANIUM has developed a high-yielding, reliable WLFO technology, and has successfully ramped that technology to high volume production. NANIUM has shipped nearly one billion WLFO packages to date utilizing a state-of-the-art 300mm Wafer-Level Packaging (WLP) production line.

"This strategic acquisition will enhance Amkor's position as one of the leading providers of WLP and WLFO packaging solutions," said Steve Kelley, Amkor's president and chief executive officer. "Building on NANIUM's proven technologies, we can expand the manufacturing scale and broaden the customer base for this technology."

"The Amkor transaction is a great fit for us and provides NANIUM and its employees with a strong platform for future growth," said Armando Tavares, President of NANIUM's Executive Board. "Amkor's technology leadership, substantial resources and global presence coupled with NANIUM's best-in-class WLFO packaging solutions will accelerate global acceptance and growth of this technology worldwide."

NANIUM is based in Porto, Portugal, employs approximately 550 people and had annual sales of approximately $40 million for their fiscal year ended September 30, 2016. The transaction is expected to close in the first quarter of 2017, subject to customary closing conditions and regulatory approvals.



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
SUSS MicroTec Opens New Production Facility In Taiwan
Onto Innovation Announces New Inspection Platform
Will Future Soldiers Be Made Of Semiconductor?
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
New Plant To Manufacture Graphene Electronics
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
EV Group Establishes State-of-the-art Customer Training Facility
K-Space Offers A New Accessory For Their In Situ Metrology Tools
DISCO's Completion Of New Building At Nagano Works Chino Plant
Changes In The Management Board Of 3D-Micromac AG
ASML Reports €14.0 Billion Net Sales
TEL Introduces Episode UL As The Next Generation Etch Platform
Panasonic Microelectronics Web Seminar
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
ITRI And DuPont Inaugurate Semiconductor Materials Lab
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
Cadence Announces $5M Endowment To Advance Research
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
AP&S Expands Management At Beginning Of 2021
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
Siemens And ASE Enable Next-generation High Density Advanced Package Designs

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event