News Article

HORIBA Reorganizes Its EU Operations

HORIBA Jobin Yvon SAS merges with its subsidiary, HORIBA FRANCE SARL. The new company will be known as HORIBA FRANCE SAS.

HORIBA Jobin Yvon SAS, a world leader in instrumentation for materials science and bio-pharmacy as well as high performance optical components, merged with its subsidiary HORIBA FRANCE SARL, an industry leader for the measurement of emissions of automotive combustion gases, pollutant emissions from industrial processes and air quality on January 3, 2017.

By combining their resources, the new company, HORIBA FRANCE SAS, who is a wholly owned subsidiary of HORIBA, Ltd. in Japan, will be better able to anticipate the rapid changes in their respective markets, and to provide innovative solutions and services.

The JOBINYVON brand, which will celebrate its 200th anniversary in 2019, is recognized worldwide for the unique performance of its scientific instrumentation. It will continue to carry out techniques such as Raman spectroscopy, fluorescence spectroscopy and diffraction gratings, and will develop on this basis specialized applications dedicated to industrial R&D.

This merger leverages the scientific know-how and knowledge of specific European process, environment and automotive markets. Thanks to its commitment and cooperation with the largest research centers in the world, HORIBA FRANCE SAS is positioned to advance the evolution of the HORIBA Group, as well as its investments in Europe. Its establishment in the scientific cluster of PARIS-SACLAY promotes open innovation, and increased development in the world of digital technologies.

James Thépot, President, and Jean-Pierre Surin, General Manager of HORIBA FRANCE SAS stated: "We are proud to have led this merger with all our employees who are determined to the HORIBA Group, in France and in Europe. The values that the HORIBA Group cultivates, put the customer at the heart of its action, and our adaptability and proximity to them are of the utmost importance".

 This merger does not entail any operational changes for existing customers and suppliers of the two previous entities.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.


Changes In The Management Board Of 3D-Micromac AG
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
Onto Innovation Announces New Inspection Platform
Will Future Soldiers Be Made Of Semiconductor?
Cadence Announces $5M Endowment To Advance Research
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
K-Space Offers A New Accessory For Their In Situ Metrology Tools
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
ITRI And DuPont Inaugurate Semiconductor Materials Lab
New Plant To Manufacture Graphene Electronics
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
TEL Introduces Episode UL As The Next Generation Etch Platform
ASML Reports €14.0 Billion Net Sales
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
SUSS MicroTec Opens New Production Facility In Taiwan
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
EV Group Establishes State-of-the-art Customer Training Facility
AP&S Expands Management At Beginning Of 2021
Panasonic Microelectronics Web Seminar
DISCO's Completion Of New Building At Nagano Works Chino Plant

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
{taasPodcastNotification} Array
Live Event