SPTS Technologies receives order from Nanium
SPTS Technologies has announced that it has received an order from NANIUM, S.A., a Portugal-based semiconductor manufacturing, test and engineering services provider, for a 300mm Sigma fxP PVD system to expand NANIUM'S Fan-out Wafer Level Packaging (FOWLP) capacity. Following the successful evaluation of the Sigma fxP PVD system for deposition of redistribution layers (RDL) for FOWLP production, NANIUM selected SPTS's PVD solution as the new process tool of record (PTOR) for their 300mm wafer-level fan-out line.
"Fan-out wafer-level packaging is rapidly becoming the packaging solution of choice for mobile applications as it provides semiconductor manufacturers with cost-effective and flexible high density packaging schemes," said Kevin Crofton, President of SPTS Technologies and Corporate Vice President at Orbotech. "NANIUM has been at the forefront of the growth of FOWLP. The addition of our 300mm Sigma PVD system will enable NANIUM to meet the accelerating demand from mobile device customers as well as address growing interest from IC manufacturers targeting automotive and medical applications."
"NANIUM is committed to delivering creative, reliable and cost-effective wafer-level packaging solutions by combining world-class expertise with leading-edge equipment," stated Steffen Kroehnert, Director of Technology at NANIUM. "SPTS's Sigma fxP PVD system is the recognized leader for FOWLP packaging schemes and has a well-established track record in volume production. To remain competitive in a cost-sensitive industry and deliver the quality and level of customer service expected by our customers, we must adopt the latest technologies and equipment to secure our position as one of the leading proponents of FOWLP. SPTS's 300mm Sigma PVD solution offers superior performance and lower cost of ownership than competing PVD systems and is a valuable addition to our portfolio of solutions."