Info
Info
News Article

Programmable Linear Hall-effect Sensor IC

The new A1377 from Allegro MicroSystems Europe is a programmable linear Hall-effect sensor IC designed for applications that require high accuracy and high resolution without compromising bandwidth.

The new device uses segmented, linearly interpolated temperature compensation technology which greatly reduces the total error of the device across the whole temperature range. As a result, it is ideally suited to linear and rotary position in automotive applications such as actuators and valves.

The A1377 is available in a through-hole, small form factor, single in-line package (SIP) and has a broad range of sensitivities and offset operating bandwidths. The accuracy and flexibility of this device is enhanced with user programmability, via the supply voltage (Vcc)and output pins, which allows it to be optimised to the application.

This ratiometric Hall-effect sensor IC provides a voltage output that is proportional to the applied magnetic field. The quiescent voltage output is user-adjustable from approximately 5 percent to 95 percent of the supply voltage. The device sensitivity is adjustable within the range of 1 to 14 mV/G.

Each BiCMOS monolithic circuit integrates a Hall element, temperature-compensating circuitry to reduce the intrinsic sensitivity drift of the Hall element, a small-signal high-gain amplifier, a clamped low-impedance output stage and a proprietary dynamic offset cancellation technique.

The features of this linear device make it ideal for use in automotive and industrial applications requiring high accuracy, and apply across an extended temperature range, from -40°C to +150°C.

The A1377 sensor is provided in a 3-pin single in-line package (UC suffix) with bypass capacitors integrated into the package. It is lead (Pb) free, with 100 percent matt-tin lead frame plating.



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
Will Future Soldiers Be Made Of Semiconductor?
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
ASML Reports €14.0 Billion Net Sales
Onto Innovation Announces New Inspection Platform
New Plant To Manufacture Graphene Electronics
Cadence Announces $5M Endowment To Advance Research
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
Panasonic Microelectronics Web Seminar
Changes In The Management Board Of 3D-Micromac AG
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
EV Group Establishes State-of-the-art Customer Training Facility
ITRI And DuPont Inaugurate Semiconductor Materials Lab
TEL Introduces Episode UL As The Next Generation Etch Platform
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
SUSS MicroTec Opens New Production Facility In Taiwan
AP&S Expands Management At Beginning Of 2021
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
K-Space Offers A New Accessory For Their In Situ Metrology Tools
DISCO's Completion Of New Building At Nagano Works Chino Plant
GOODFELLOW Confirms Membership In The BSI UK Graphene Group

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event