+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Fujitsu sensor beacons with Wirepas connectivity offer an easy-to-use IoT module

News

Fujitsu and Wirepas partner to enable secure, scalable and flexible IoT solutions.
The Fujitsu sensor beacons with Wirepas connectivity offer an easy-to-use, connected module for various IoT application areas, such as healthcare, industrial automation and smart building.
With the Wirepas connectivity protocol, Fujitsu is now able to offer ready-to-go solutions for various IoT applications "“ for example a connected sensor beacon with an embedded high-accuracy accelerometer/temperature sensor.

The Fujitsu sensor beacon is a small (40 x 31 x 12 mm) CR2450 battery cell powered node that will last for years. Fujitsu also offers the possibility to enable Wirepas connectivity on the high-quality small module FWM7BLZ20, currently released as the best-in-class Bluetooth version 4.2 module. The small form factor of just 15.7 x 9.8 x 1.7mm, the integrated 32 MHz and 32.768kHz crystal oscillators and high performance embedded antenna around the Nordic Semiconductor nRF52832 SoC provide the perfect module for the Wirepas de-centralized IoT wireless network solution.

-In the constantly evolving and growing IoT market, customers are looking for upgradable solutions instead of just hardware. This is exactly what we are bringing into to the market, together with Wirepas. For Own Equipment Manufacturers, we offer our wide range of wireless modules on which Wirepas Connectivity can easily be embedded, Dennis van Doorn, Marketing Manager, Wireless Solutions, from Fujitsu says.

Wirepas connectivity is a de-centralized radio communications protocol that can be used in any device, with any radio chip and on any radio band. The target market is industrial and infrastructure level IoT applications that pose high requirements for the reliability, scale and total cost of ownership. The technology is already deployed in several large-scale IoT applications.

- Fujitsu is a great addition to our partner ecosystem. Their radio modules are greatly valued by the customers for their performance and quality. The constantly growing product portfolio of Fujitsu components offers a great platform on top of which Wirepas Connectivity can add value. We are looking forward to changing the world one connected thing at a time, Wirepas CEO Teppo Hemiä envisions.

IoT is driving the development and growth of connectivity technologies, and different IoT applications have very diversified needs for connectivity in terms of power, bandwidth, range, latency for example. Moreover, the requirements evolve over time per application. Wirepas Connectivity enables trade-offs between critical applications requirements "“ run time. Also, over-the-air (OTA) updates can be done for the application software and connectivity firmware, which enables longer lifetime for the hardware and improves total cost of ownership.


Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: