+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

Demand for EVG wafer bonding solutions greater than ever


EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved an industry milestone with more than 1100 EVG wafer bonding chambers installed at customer facilities worldwide to date. This milestone cements EVG's technology and market leadership in wafer bonding, which is an enabling process for volume manufacturing of semiconductor advanced packaging, MEMS, CMOS image sensors, and radio frequency (RF) devices. The EVG500, EVG850, GEMINI and ComBond series of wafer bonding solutions, in particular, are seeing strong demand due to their industry-leading performance and cross-platform compatibility, which allows customers to more easily ramp up their R&D processes to high-volume manufacturing.

Every four seconds, a wafer is bonded with an EVG system. Shown here is a 300-mm bond chamber in an EVG560 Automated Wafer Bonding System. The EVG560 accepts up to four bond chambers with various configuration options for all bonding processes, including anodic, thermo compression, fusion bonding and LowTemp plasma bonding.

"For our high-volume customers, it is essential that they have ready access to industry-proven, cost-effective and high-yielding process solutions. EV Group has closely collaborated with customers and partners for nearly three decades to innovate wafer bonding technology, which has led to the establishment of our technology as the de-facto industry standard for high-volume manufacturing," stated Hermann Waltl, executive sales and customer support director at EV Group. "Our product offerings span the entire manufacturing chain from R&D and small-scale production environments to full-scale, high-volume production. This enables us to support our customers throughout as they transform new ideas into real-world products."

EV Group has installed more than 1100 EVG wafer bonding chambers at customer facilities worldwide to date. Shown here is a GEMINI automated production wafer bonding system for 200-mm substrates, which integrates automated alignment and bonding stations as well as pre-processing modules.

EVG's wafer bonding solutions for adhesive and fusion/hybrid bonding, metal bonding (such as solder and eutectic), and high-vacuum encapsulation undergo continuous innovation in a variety of critical areas, including temperature and process uniformity, vacuum control, wafer alignment and ease of use to ensure a high-yielding and high-throughput bonding process. Manual and semi-automated wafer bonders are fully compatible with EVG production bonding systems, which shortens the development time for customers to bring new innovative devices to market.

For adhesive, solder and eutectic bonding, the EVG500 series of semi-automated wafer bonders and GEMINI series of fully-automated wafer bonders support non-hermetic, cost-efficient encapsulation of CMOS image sensors, surface acoustic wave (SAW) filters for wireless RF chips, and other devices for mobile phones and other high-volume consumer applications. Additionally, tool configurations can be tailored to more demanding bond processes such as hermetic encapsulation for MEMS devices.

For high-vacuum encapsulation bonding, the new EVG ComBond automated high-vacuum wafer bonder provides ultra-high vacuum encapsulation (10-8 mbar) needed for next-generation MEMS devices, such as gyroscopes, microbolometers, and advanced sensors used in autonomous cars, virtual reality headsets and other applications.

For fusion bonding, the EVG850LT and the GEMINI FB automated fusion bonders enable manufacturing of high-accuracy optical devices, image sensors, and engineered substrates such as silicon-on-insulator (SOI), silicon carbide (SiC) and gallium nitride (GaN) for RF, power and other high-speed/high-efficiency devices.

Added Waltl, "EVG is continuously improving our process solutions to address wider market applications and more stringent industry requirements. This has paid off for our customers, which in turn has enabled us to maintain our leadership position in the wafer bonding market. Every four seconds, a wafer is bonded with an EVG system. We are proud to bring our expertise gained from this far-reaching installed base to our customers around the world."

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: