Besi Reports Strong First Half 2017 Business Outlook

BE Semiconductor Industries N.V. ("Besi"), a manufacturer of assembly equipment for the semiconductor industry, has announced its results for the first quarter ended March 31, 2017.
Highlights include: Revenue of € 110.2 million, up 18.4 percent vs. Q4-16 and 39.5 percent vs. Q1-16 due primarily to favourable industry conditions and higher die bonding shipments for smart phone applications. In line with guidance
Orders of € 239.8 million, up 162.4 percent vs. Q4-16 and 130.8 percent vs. Q1-16 due primarily to large die bonding capacity build by IDMs for next generation mobile devices as well as automotive and high-end cloud server applications
Net income of € 24.3 million is up 45.5 percent, or € 7.6 million, vs. Q4-16 and 203.8 percent, or € 16.3 million, vs. Q1-16 due to strong revenue growth, continued gross margin improvement and cost controls