News Article

ClassOne Cuts Copper Plating Costs

New CopperMax system can reduce plating costs by over 95 percent

ClassOne Technology, manufacturer of 'budget-friendly' Solstice plating systems, has announced that its new CopperMax system is demonstrating major copper plating cost reductions for users of ≤200mm wafers.

"Like the rest of our equipment, this new chamber aims to serve all those smaller wafer users who have limited budgets," said Witt. "Simply stated, CopperMax is going to give them a lot more copper plating performance for a lot less."

ClassOne cited actual performance data from a CopperMax pilot installation on a Solstice tool at a Fortune 100 customer. Over a six-month period the customer tracked their actual production operating costs while using the new chamber for copper TSV, Damascene and high-rate copper plating. For the three processes with CopperMax they reported that operating costs were reduced between 95.8 percent and 98.4 percent compared with previously used conventional plating chambers.

"Many of our emerging market customers are starting to do copper plating," said Kevin Witt, President of ClassOne Technology. "So we've spent a lot of time on the process, working to reduce customer costs and also increase performance. And the new CopperMax chamber is proving to do both."

ClassOne pointed out that consumables are the largest cost factor in copper plating. Optimising copper plating generally requires the use of expensive organic additives - which are consumed very rapidly and need to be replenished frequently.

"We learned, however, that over 97 percent of those expensive additives were not being consumed by the actual plating process," said Witt. "Most were being used up simply by contact with the anode throughout the process! So, we designed our new copper chamber specifically to keep additives away from the anode -- and the results are pretty dramatic. Significant savings can be realized by high- and medium-volume users with high throughputs as well as by lower-volume and R&D users that have long idle times."

The company explained that the CopperMax chamber employs a cation-exchange semipermeable membrane to divide the copper bath into two sections. The upper section contains all of the additives, and it actively plates the wafer. The lower section of the bath contains the anode that supplies elemental copper -- which is able to travel through the membrane and into the upper section to ultimately plate the wafer. However, the membrane prevents additives from traveling down to the anode, where they would break down and form process-damaging waste products.

As a result, the CopperMax bath remains much cleaner, and bath life is extended by over 20x. This increases uptime, enables higher-quality, higher-rate Cu plating, and it reduces cost of ownership very substantially.

For example, a customer using a Solstice system with six CopperMax chambers and running TSV and high-rate copper plating will save over $300,000 per year just from additive use reductions.

In addition, the CopperMax also reduces Cu anode expenses. The chamber is designed to use inexpensive bulk anode pellets instead of solid machined Cu material, which cuts anode costs by over 50 percent. And since the pellets have 10x greater surface area they also increase the allowable plating rates.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.


Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
Panasonic Microelectronics Web Seminar
K-Space Offers A New Accessory For Their In Situ Metrology Tools
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
TEL Introduces Episode UL As The Next Generation Etch Platform
ITRI And DuPont Inaugurate Semiconductor Materials Lab
AP&S Expands Management At Beginning Of 2021
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
DISCO's Completion Of New Building At Nagano Works Chino Plant
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
SUSS MicroTec Opens New Production Facility In Taiwan
Changes In The Management Board Of 3D-Micromac AG
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
New Plant To Manufacture Graphene Electronics
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
Onto Innovation Announces New Inspection Platform
ASML Reports €14.0 Billion Net Sales
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
Will Future Soldiers Be Made Of Semiconductor?
EV Group Establishes State-of-the-art Customer Training Facility
Cadence Announces $5M Endowment To Advance Research

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
{taasPodcastNotification} Array
Live Event