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Arbitration Panel Awards Refund To BlackBerry

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Qualcomm has announced a binding interim arbitration award requiring Qualcomm to refund a sum of $814.9 million, plus interest and attorneys' fees, to BlackBerry Incorporated related to royalties for certain past sales of subscriber units. The parties had agreed to arbitrate a contract dispute relating to one specific issue: whether Qualcomm's voluntary per unit royalty cap program applied to BlackBerry's non-refundable prepayments of royalties for sales of a specified number of subscriber units from 2010 through the end of 2015. 

While Qualcomm does not agree with the decision, it is binding and not appealable. The arbitration decision was limited to prepayment provisions unique to BlackBerry's license agreement with Qualcomm and has no impact on agreements with any other licensee.



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

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VIEW SESSIONS
Changes In The Management Board Of 3D-Micromac AG
New Plant To Manufacture Graphene Electronics
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
SUSS MicroTec Opens New Production Facility In Taiwan
TEL Introduces Episode UL As The Next Generation Etch Platform
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
ASML Reports €14.0 Billion Net Sales
DISCO's Completion Of New Building At Nagano Works Chino Plant
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
EV Group Establishes State-of-the-art Customer Training Facility
Will Future Soldiers Be Made Of Semiconductor?
Cadence Announces $5M Endowment To Advance Research
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
ITRI And DuPont Inaugurate Semiconductor Materials Lab
Onto Innovation Announces New Inspection Platform
K-Space Offers A New Accessory For Their In Situ Metrology Tools
Panasonic Microelectronics Web Seminar
AP&S Expands Management At Beginning Of 2021
Siemens And ASE Enable Next-generation High Density Advanced Package Designs

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