Info
Info
News Article

Linde Invests Over EUR 110 Million In China To Strengthen Position

News

Gases and engineering company The Linde Group, through its electronics gases joint venture in China, Linde LienHwa, is expanding its commitment to China and the Asia Pacific region through investments of over EUR 110 million. The capital is being allocated for new on-site gas production facilities in major electronics manufacturing clusters in the eastern and central provinces of China. These investments with new and established customers will support multiple long-term contracts to provide electronics gases to leading-edge foundry, memory and flat panel display fabs.

Sanjiv Lamba, Member of the Executive Board of Linde AG and Chief Operating Officer for Asia Pacific, said, "These significant capital investments underscore Linde's continued commitment to our business in Asia Pacific in general, and China, in particular, and build upon earlier investments and capabilities in the region, including the recent start-up of our state-of-the-art R&D centre in Taichung, Taiwan. Asia will continue to be a growth driver for Linde and we will continue to invest in Asia."

Stan Tang, President and General Manager of Linde LienHwa in China added, "Linde's over EUR 110 million in new on-site plant investments demonstrates our commitment to the rapidly developing Chinese electronics manufacturing sector. The supply contracts that Linde has secured in China validate our customers' confidence in the safety, quality and reliability of our gases supply and systems."

SEMI (Semiconductor Equipment and Materials International), the global trade association that represents the electronics industry, estimates that more than 50 percent of new semiconductor fab investments in the next few years will be in China. China has made a large commitment to the electronics industry through the National IC Industry Investment Fund, more commonly known as The Big Fund, where it has pledged around EUR 20 billion from 2014 through 2017 to build the semiconductor industry in China. An additional EUR 82 billion is expected to be added from private equity funds and local governments.

Linde LienHwa, together with Linde's Engineering Division, will design and construct these facilities. Linde SPECTRA-N nitrogen generators have the highest level of operational efficiency, enabling lowest cost of ownership and reducing environmental footprint. These projects include multiple gaseous nitrogen plants, with a combined capacity of over 110,000 Nm3/hr (normal cubic meters per hour), plus several other bulk gas supply systems. All the plants will be on stream by the end of 2017.

Linde and its joint venture partners in China currently deliver gases solutions and systems to more than a dozen electronic production facilities across the major segments of the electronics industry, including those in semiconductor, display, solar and LED. Linde is also committed to meeting the electronic special gas (ESG) needs of its growing Chinese customer base. For example, Linde produces bulk amounts of key ESGs like ammonia (NH3) and nitrous oxide (N2O) in China, South Korea and Taiwan to ensure local supply and regional supply chain security. 

Linde Electronics, the global electronics business of The Linde Group, supplies the world's largest semiconductor manufacturers in Taiwan, Korea and the US, and is securing a leading position in China with international and domestic manufacturers. Linde Electronics is committed to building an infrastructure of specialty gas capabilities and co-investment partnerships in China.



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
SUSS MicroTec Opens New Production Facility In Taiwan
Onto Innovation Announces New Inspection Platform
ITRI And DuPont Inaugurate Semiconductor Materials Lab
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
Panasonic Microelectronics Web Seminar
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
New Plant To Manufacture Graphene Electronics
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
K-Space Offers A New Accessory For Their In Situ Metrology Tools
ASML Reports €14.0 Billion Net Sales
TEL Introduces Episode UL As The Next Generation Etch Platform
Changes In The Management Board Of 3D-Micromac AG
AP&S Expands Management At Beginning Of 2021
Will Future Soldiers Be Made Of Semiconductor?
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
EV Group Establishes State-of-the-art Customer Training Facility
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
DISCO's Completion Of New Building At Nagano Works Chino Plant
Cadence Announces $5M Endowment To Advance Research

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event