Info
Info
News Article

Wet Process Innovations Await At AP&S Booth At Semicon China

News

Semicon China "“ a key event for the semiconductor manufacturing industry in China will kick off shortly in the New International Exhibition Centre in Shanghai.

AP&S International, suppliers of wet process technology worldwide, will display its innovations at the booth 2316, German Pavilion, Hall W2.

"2017 is an exciting year for AP&S. We have many highlights to present to our visitors" says Horst Hall, shareholder of AP&S. "With focus on the increase of customer value, we made significant investments in the following three areas last year: After Sales Services business unit, Software development and In-house application laboratory. Now we can offer our customers more comfort through all-round support for their fab: technical support, upgrades, trainings and refurbishment, just to name a few, - all is now available from one source. Higher process efficiency is offered by our future proof 4.0 industry software solutions. Security and process experience is what customers receive by their visit in our in-house laboratory. I really look forward to explain these advanced concepts to our visitors at Semicon China."

 "We invite everyone, involved in the semiconductor-, MEMS- and micro-structuring production processes to visit our booth. High flexibility is what makes our modular product spectrum unique in the market. Whether a standard wet process tool or a customer-specific solution is required, our range includes the right solution, perfectly fitting to customers' needs", adds Wenjian Gu, Head of the AP&S China location.

CEA-Leti Unveils Navigation-Grade Gyroscopes
Brewer Science’s Newly Launched Smart Devices Will Be Displayed At CES
ULVAC Expands Process Capability
3D-Micromac AG Appoints Marko Gerlach Chief Financial Officer
Are You Facing Decisions And Challenges With Interconnects, Pattern Transfer, 3D Scaling And Atomic Scale Processing And Integration?
YES Partners With Osiris For Edge Film Removal Technology
Imec Demonstrates Significant Performance Gains Utilizing Backside 3D SOC Interconnects
Kurt J. Lesker Acquires KDF Electronics & Vacuum Services
3D-Micromac AG Appoints Hartmut Schubert To Chief Technology Officer
BASF And Entegris Sign Agreement On Sale
SiLC Rolls Out Chip-Integrated FMCW LiDAR Sensor
The All-round Smart Proximity Sensor Chip
Detecting And Classifying Defects In Semiconductor Manufacturing Via Atomic Force Microscopy
ERS Electronic Appoints Mark Wachter As Chief Financial Officer
NTU Singapore Launches Quantum Science And Engineering Centre
CEA-Leti Breakthrough For Next-Generation Memories And RRAM Energy-Storage
ALD Is Taking Off In More-than-Moore Applications
SUSS MicroTec And SET To Develop Equipment Solution For 3D Chip Integration
Park Systems Combines AFM With White Light Interferometry
Mycronic Receives Order For An SLX Mask Writer
Siemens Collaborates With PDF Solutions To Boost IC Yield And Speed Time
Edwards Launches New Cryopump
Brewer Science Presents Best Practices For Workplace Culture At SEMICON West
EV GROUP Brings High-speed High-precision Metrology To 3D Heterogeneous Integration

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
Live Event