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QuickLogic offer eFPGA technology on SMIC 40nm low leakage process


SMIC, one of the leading semiconductor foundries in the world and QuickLogic, a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, display bridge and programmable logic solutions, has announced the availability of QuickLogic's ArcticPro embedded FPGA (eFPGA) technology on SMIC's 40nm Low Leakage (40LL) process.

QuickLogic's advanced architecture, mature software and IP ecosystem, in combination with the SMIC 40LL process, offers SoC designers an easy-to-implement, highly reliable and extremely low power eFPGA solution. The ArcticPro eFPGA technology, which is already in production on a variety of leading processes, is the industry's first eFPGA IP to be offered on the SMIC 40LL technology node.

QuickLogic's ArcticPro eFPGA, in the SMIC 40LL process, gives developers of SoCs the ability to add a high degree of post manufacturing design flexibility to devices. Because it's a single device platform, multiple chip variants can be created from a single mask set, enabling customization to address fragmented and/or rapidly evolving standards. This not only equates to a significant reduction in cost, but also provides developers with the flexibility they need to support new and unique customer requirements and to target new markets. The ultra-low power consumption of the ArcticPro eFPGA makes it especially well-suited for handheld, wearable and IoT endpoint applications, all of which require a long battery life.

Dr. Tianshen Tang, EVP of Design Service, at SMIC, stated, "This is the first eFPGA IP offering to be available on the SMIC 40LL process. We chose QuickLogic because the company has decades of experience with low-power FPGA architectures and supporting software. Now our customers can benefit from this technology and its unprecedented post-manufacturing flexibility."

Brian Faith, QuickLogic's president and CEO, added, "Supporting the SMIC 40LL process is a significant step forward for ArcticPro eFPGA technology. It's now broadly available on a popular low-power process, well-supported and easy to implement. We expect these factors to drive broad adoption for a wide range of low power SoC designs."

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