Info
Info
News Article

Rudolph Achieves Customer Success With Firefly Inspection System

News

Rudolph Technologies has announced that its Firefly inspection systems, shipped to fulfil previously announced orders from multiple semiconductor manufacturers, are now qualified for production.

The Firefly Inspection Systems provide high-resolution visual and non-visual inspection in a variety of advanced packaging processes, including fan-out wafer-level packaging, panel-level packaging and wafer-level chip-scale packaging. Rudolph expects over $5M in revenue in Q3 2017 from the accepted systems. Additional Firefly System shipments expected in Q4 2017.

"This latest inspection technology enables us to go beyond the limits of traditional area-scan technology to offer our customers an extendable platform for sub-micron resolution at a high throughput across a broadening range of applications," said Mike Plisinski, chief executive officer, Rudolph Technologies. "As expected, our Firefly systems are identifying defects that were previously undetectable. We will continue to collaborate closely with our customers to further enhance the platform and address our customers' challenges."

"The Firefly system features our patented Clearfind Technology to expose non-visual defects that traditional illumination cannot detect," said Mike Goodrich, vice president and general manager of Rudolph's Process Control Group. "Our customers regularly find defects that had been missed by conventional techniques, including missing or shorted redistribution layer (RDL) lines, un-etched organic film on under bump metallization (UBM) pads, and residual photoresist (PR) and polyimide (PI)."

Process control for advanced packaging is becoming increasingly more difficult as features, such as RDL, shrink to single-micron sizes, making them extremely hard to inspect due to nuisance defects caused by metal grains. Goodrich explained, "Clearfind Technology detects previously invisible defects, and when paired with Rudolph's Discover analytics software, provides comprehensive solutions for difficult process challenges. For example, on one customer's product, the Firefly system detected thin RDL lines that were below specification and had been missed by traditional bright field illumination. When the customer used Discover's advanced analysis of defects added at each layer, the wafer map enabled them to identify and eliminate the root cause of the problem."



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
Changes In The Management Board Of 3D-Micromac AG
Cadence Announces $5M Endowment To Advance Research
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
SUSS MicroTec Opens New Production Facility In Taiwan
New Plant To Manufacture Graphene Electronics
Onto Innovation Announces New Inspection Platform
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
Will Future Soldiers Be Made Of Semiconductor?
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
Panasonic Microelectronics Web Seminar
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
TEL Introduces Episode UL As The Next Generation Etch Platform
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
K-Space Offers A New Accessory For Their In Situ Metrology Tools
ITRI And DuPont Inaugurate Semiconductor Materials Lab
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
DISCO's Completion Of New Building At Nagano Works Chino Plant
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
ASML Reports €14.0 Billion Net Sales
AP&S Expands Management At Beginning Of 2021
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
EV Group Establishes State-of-the-art Customer Training Facility
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event