Advanced Wafer ID Readers Improve Read Rates Drastically
The IOSS WID120 Wafer ID Reader is the newest generation of advanced Wafer ID Readers.It was designed to close the gap between easy usability and highest flexibility and took over the high time consuming (re)teaching procedures of the user.
With up to 18 different light modes, the IOSS WID120 decodes OCR, Barcode, DataMatrix and QR-Code markings on any kind of wafer, regardless of the wafer material. Thanks to its fully automatic light control and intelligent configurations handling, the IOSS WID120 can tweak itself and improve your read rates drastically. It's the first tool of this kind, which saves the re-teaching completely.
The guided teaching process makes it very easy for everyone to setup the camera. Already known functions as master/slave functionality and database connection are still available with this new model. Picture export via FTP is now also possible.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
and will feature online
versions of the market-leading physical events: CS International
and PIC International
PLUS a brand new Silicon Semiconductor International
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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