News Article

Aviation Depends On Sensors And Big Data


Commercial aviation has long depended on sensors to keep its planes flying safely, but new generations of high-end sensors (HES) are taking Big Data and analytics to new heights

Sitting inside an Airbus A350, it is easy to think about everything else that might affect one's inflight experience, and easy to overlook the myriad sensor systems that make commercial air travel safer and more efficient. And while they can't improve airline food or quiet quarrelsome teenagers, the 6,000 sensors inside an A350 are hard at work, ensuring safety and smooth travel.

In discussing its forthcoming Airbus A380-1000 "“ capable of holding up to 1,000 passengers "“ officials at the company recently revealed that their newest aircraft are "˜all-in' when it comes to high-end sensor (HES) technology. New Airbus airliners will have up to 10,000 sensors along its wings alone, plus a to-be-determined quantity in many other flight systems.

Advanced sensor technology is so common in Airbus and Boeing aircraft that from an engineering perspective, airliners are becoming as much data capture platforms as they are modes of transportation. There are 5,000 commercial aircraft in the sky at any one time over the US alone; 35 million departures each year. Daily flights globally soar to 93,000 from about 9,000. Sensors are found across wings, in engines, in passenger and cargo compartments; practically every square centimeter of an airliner is brimming with sensors that monitor everything from engine performance to how often reading lights are activated.

While the need for ever-increasing sensor data is to be expected in such a time sensitive and safety conscious industry as air travel, it may be surprising to realize that each and every Airbus A350 generates 2.5 Tb of data each day it operates. When the new A380-1000 debuts, that data cache will more than triple. Aircraft operational data is also complex: imagine the data from 10,000 wing sensors entwined with data streams from literally thousands of other sensors.

Data analytics has already proved a sound investment for airlines that have discovered that with the right analytical approach, data can be used to eliminate redundancies, predict routes passengers may favor and improve safety. Engine data is amongst the most complex, but by monitoring every operational aspect, managers have already saved millions in fuel costs, improved routes and safety, and learned to reallocate ground resources so when flights are delayed, backup plans can be automatically triggered to improve passenger satisfaction (and reduce revenue loss for the airlines.)

High-end sensors (HES) are key to commercial aviation's use of data analytics to improve safety, reduce costs, and improve inflight experiences. Sensors are increasingly critical in both commercial and defence aviation platforms"”part of a growing global sensor ecosystem that IHS Markit predicts will reach (USD) $20 billion within the next three years.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.


Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
Will Future Soldiers Be Made Of Semiconductor?
Panasonic Microelectronics Web Seminar
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
K-Space Offers A New Accessory For Their In Situ Metrology Tools
SUSS MicroTec Opens New Production Facility In Taiwan
ASML Reports €14.0 Billion Net Sales
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
ITRI And DuPont Inaugurate Semiconductor Materials Lab
New Plant To Manufacture Graphene Electronics
Cadence Announces $5M Endowment To Advance Research
Onto Innovation Announces New Inspection Platform
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
DISCO's Completion Of New Building At Nagano Works Chino Plant
Changes In The Management Board Of 3D-Micromac AG
AP&S Expands Management At Beginning Of 2021
EV Group Establishes State-of-the-art Customer Training Facility
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
TEL Introduces Episode UL As The Next Generation Etch Platform
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
GOODFELLOW Confirms Membership In The BSI UK Graphene Group

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
{taasPodcastNotification} Array
Live Event