Info
Info
News Article

ERS Introduces Cutting-edge Innovation In Semiconductor Thermal Testing


ERS electronic GmbH, supplier of thermal test solutions for semiconductor production, is announcing a major innovation in its product range of thermal test solutions for the semiconductor industry, significantly boosting user flexibility and cost effectiveness.

The new AirCool PRIME family of thermal chucks, developed in close cooperation with MPI Corporation, offers unsurpassed flexibility and the industry's fastest transition times. With this achievement, the system greatly increases the customer's test throughput. Likewise, the system features the largest variety of thermal ranges on the market, offering the unmatched flexibility over a wide range of semiconductor test applications.

Available initially for 300mm (12") wafers, the ERS AirCool PRIME incorporates a flexible and modular top plate design concept allowing easy field upgradeability. Through the integration of the PRIME™ Thermo Shield (PTS) into the chuck, the AirCool PRIME products drastically shorten the soaking times within the test cycle. Thus, the system achieves Instantly-Ready-For-Test IRFT capability. It creates a mini-environment around the chuck which results in fast and accurate tests. Its ultra-low signal noise in the single-digit Femto-Ampere (fA) range allows extreme sensitive measurement.

In order to tailor the system's thermal capability to the customer's requirements and budget, the system can be configured for a variety of temperature ranges between -60°C and +300°C.


Through ERS' Super Booster technology, test temperatures down to -10°C can be achieved without a separate chiller. For lower test temperatures, down to -40°C, ERS is offering a compact chiller which occupies only one third of the footprint of comparable systems.


"Co-developing the Air Cool PRIME technology with ERS Electronic has enabled significant advancements in feature sets that enable mutual customers to become much more effective and efficient in thermal wafer probing applications," says Stojan Kanev, General Manager of MPI Corporation's Advanced Semiconductor Division. "Combining the talent of our organizations has once again proven highly successful in terms of providing powerful, customer oriented solutions. Reductions in equipment footprint size and significantly reduced CDA consumption are two critical cost savings the AirCool PRIME Technology provides yet it is the optimized thermal management, quick set-up, distinguished electrical performance and enhanced throughput that are absolute game changers."

"We were very pleased with the cooperation with MPI which has given us valuable insights and expertise in the challenging analytical wafer probing market" comments Klemens Reitinger, CEO of ERS electronic GmbH. "Today's semiconductor market with megatrends like IoT, electromobility and renewable energies, places extreme requirements on chips in terms of high-frequency and high voltage technology. It is precisely the customers focusing on these application fields that will benefit most from our new innovations. For example, AirCool PRIME enables fast and thorough testing of power semiconductors for voltages up to 12kV", explains Reitinger. "MPI´s experience in the highly challenging RF Probing helped us include innovative features for testing High Speed and RF circuits for the IoT market", he adds.



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
DISCO's Completion Of New Building At Nagano Works Chino Plant
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
ASML Reports €14.0 Billion Net Sales
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
Cadence Announces $5M Endowment To Advance Research
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
AP&S Expands Management At Beginning Of 2021
K-Space Offers A New Accessory For Their In Situ Metrology Tools
New Plant To Manufacture Graphene Electronics
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
TEL Introduces Episode UL As The Next Generation Etch Platform
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
Will Future Soldiers Be Made Of Semiconductor?
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
Changes In The Management Board Of 3D-Micromac AG
Panasonic Microelectronics Web Seminar
ITRI And DuPont Inaugurate Semiconductor Materials Lab
Onto Innovation Announces New Inspection Platform
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
EV Group Establishes State-of-the-art Customer Training Facility
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
SUSS MicroTec Opens New Production Facility In Taiwan
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event