Disco Develop Stealth Dicing Laser Saw


DISCO has developed a stealth dicing (SD)*1 laser saw
DFL7362 which supports Φ300 mm wafers. DFL7362 achieves the high-throughput
processing of thin Si wafers by reducing the workpiece transfer time due to
improvements to the platform and the processing axis speed. Furthermore,
DFL7362 can be equipped with a wide range of optional functions which achieve
both high processing-quality and high productivity, such as dual-use wafer and
frame transferring, and kerf checks during processing. DFL7362 will be
exhibited in SEMICON Japan 2017 held at Tokyo Big Sight from December 13 to 15.

*1 Die singulation technology. An SD layer is formed on the
dicing lines by focusing the laser beam inside the workpiece before singulation
using die expansion or similar methods. Through the integration of the dicing
technology that DISCO has developed and the SD engine that Hamamatsu Photonics
Corporation has developed specifically for DISCO, stable, high-accuracy
processing can be achieved.

In recent years, with the widespread use of smartphones in
Asia and growing needs for higher capacity and higher operation-speed storage
and servers, the demand for flash memory is increasing. With flash memory, in
order to stack die in the limited packaging space, it is necessary to cut out
high-quality, thin die from the wafer. In order to meet these needs, DISCO
provided the SDBG (Stealth Dicing Before Grinding) process*2 through DFL7361,
which is already being used by many memory manufacturers throughout the world.
The development of DFL7362 enables 30 % throughput improvement compared to the
previous model and supports upgraded market needs.

*2 Grinding the backside of the wafer and then performing
singulation by thinning the wafer down until the designated thickness after
performing the SD process.

Future Schedule. Sales will begin in December 2018.

Axis Operation Speed Comparison

Webinar: On-Site Hydrogen Production Improves Safety, Quality, And Productivity In Wafer, Chip And Semiconductor Manufacturing
Himax Technologies Rebukes Motley Fool Article
Pfeiffer Vacuum Opens New High-tech Production Site In Romania
ON Semiconductor To Demonstrate Innovation In Automotive, Power Conversion And IoT At Electronica
VTT Is Ranked Fourth In The World's Largest Research Funding Programme
Biosensor Allows Real-Time Oxygen Monitoring For ‘Organs-On-A-Chip’
Palomar Technologies Awarded ISO 9001:2015 Certificate
ESI’s New Allegro LC Extends High-Volume Test Capability To Larger MLCCs
Imec.xpand Raises EUR 117 Million To Invest In Innovative, Early-stage Ideas
RIT Awarded $422K Grant For PIC Technology
Infineon Expands U.S.-based IoT Security Research And Development Programs
Future Of Quantum Technology In UK Given Significant Funding Boost
Cadence Recognized With Four 2018 TSMC Partner Of The Year Awards
Intel Respond In Court To Qualcomm’s Claims
Thermco Systems Expands Global Operations With Acquisition Of CSD Epitaxy
AES Announces Acquisition Of Advanced Research Manufacturing (ARM)
Shin-Etsu Silicones Of America Primed For Growth
Mirsense And XenomatiX Win Technology Showcase At European MEMS, Imaging And Sensors Event
Picosun Launches New Solutions Specially Targeted For Healthcare Industries
Helium Leak Detector Solutions
NanoScientific Symposium On Scanning Probe Microscopy (SPM)
Siltectra Ramps Up Wafering Services
Teledyne E2v’s Emerald 12M And 16M Image Sensors Enter Mass Production
Brixon Licenses Sensor Technology From ORNL

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: