+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Toshiba unveils UFS devices utilizing 64-layer, 3D flash memory

News

Toshiba Memory America, Inc. (TMA)*, has begun sampling Universal Flash Storage (UFS) devices[1] utilizing its cutting-edge 64-layer BiCS FLASH 3D flash memory.[2] The new UFS devices meet performance demands for applications that require high-speed read/write performance and low power consumption, including mobile devices such as smartphones and tablets and augmented /virtual reality systems.

The new lineup will be available in four capacities: 32 gigabyte (GB), 64GB, 128GB, and 256GB[3]. All of the devices integrate flash memory and a controller in a single, JEDEC-standard 11.5x13mm package. The controller performs error correction, wear leveling, logical-to-physical address translation, and bad-block management "“ allowing users to simplify system development.

All four devices are compliant with JEDEC UFS Ver. 2.1, including HS-GEAR3, which has a theoretical interface speed of up to 5.8Gbps per lane (x2 lanes=11.6Gbps) while also suppressing any increase in power consumption. Sequential read and write performance[4] of the 64GB device are 900MB/sec and 180MB/sec, while the random read and write performance are approximately 200 percent and 185 percent better, respectively, than those of previous generation devices[5]. Due to its serial interface, UFS supports full duplexing, which enables both concurrent reading and writing between the host processor and UFS device.

Toshiba was the first company in the world[6] to announce 3D flash memory technology, and the addition of 3D-based UFS keeps the company at the forefront of innovation while simultaneously enhancing its existing lineup of BiCS FLASH solutions.

"By bringing our industry-leading BiCS FLASH technology to UFS, we continue to expand the capabilities of our embedded storage solutions," noted Scott Beekman, director of managed flash memory products for TMA. "Higher performance, good power efficiency and an expanded density lineup all enable existing and future applications to realize new possibilities."


Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: