Boston Semi Automation Modules For Strip Handling Equipment
Boston Semi Equipment (BSE), a global semiconductor test handler manufacturer and provider of test automation technical services, today announced that it has started shipping units of its new strip load/unload module to a top 10 semiconductor manufacturer. The automation modules handle magazines containing strips holding semiconductor devices. The freestanding modules dock to strip-processing equipment via a SMEMA-compliant interface. Operators set up and control the modules using a color touch-screen monitor.
"BSE's custom engineering group works with semiconductor companies to provide them the exact automation solutions they require," said Kevin Brennan, vice president of marketing for BSE. "Our multidisciplined team started with our customer's specification for the strip automation module, and handled the project from concept through to manufacturing of final units. With our global service organization, we can support these modules anywhere in the world."
BSE's custom engineering group helps companies accelerate their internal product development activities. Working with BSE, companies can implement cost savings and productivity improvement solutions sooner, helping to grow their market share and improve profits.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
and will feature online
versions of the market-leading physical events: CS International
and PIC International
PLUS a brand new Silicon Semiconductor International
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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