Veeco, AMC And SGL Settle Patent Dispute
MOCVD business 'back to normal' after months of IP litigation in US and Chinese courts
Veeco Instruments, Advanced Micro-Fabrication Equipment( AMEC), and SGL Carbon SE (SGL), have mutually agreed to settle the pending litigation among the parties and to amicably resolve all pending disputes, including AMEC's lawsuit against Veeco before the Fujian High Court in China and Veeco's lawsuit against SGL before the US District Court for the Eastern District of New York.
John R. Peeler, chairman and CEO of Veeco, commented: "I am pleased to report that we have reached a mutually agreed settlement of the pending IP disputes and we are back to normal business operations in our MOCVD business."
AMEC's Chairman and CEO, Gerald Yin, stated: "This settlement is a good example of how competitors can resolve IP matters for the benefit of their global customer base."
As part of the settlement, all legal actions worldwide (in court, patent offices and otherwise), between Veeco, AMEC and SGL, and their affiliates, will be dismissed and/or otherwise withdrawn. As a result, all business processes, including sales, service and importation, will be continued.
Terms of the settlement were not disclosed.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
and will feature online
versions of the market-leading physical events: CS International
and PIC International
PLUS a brand new Silicon Semiconductor International
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
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We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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