Info
Info
News Article

Veeco, AMC And SGL Settle Patent Dispute

News
MOCVD business 'back to normal' after months of IP litigation in US and Chinese courts

Veeco Instruments, Advanced Micro-Fabrication Equipment( AMEC), and SGL Carbon SE (SGL), have mutually agreed to settle the pending litigation among the parties and to amicably resolve all pending disputes, including AMEC's lawsuit against Veeco before the Fujian High Court in China and Veeco's lawsuit against SGL before the US District Court for the Eastern District of New York.

John R. Peeler, chairman and CEO of Veeco, commented: "I am pleased to report that we have reached a mutually agreed settlement of the pending IP disputes and we are back to normal business operations in our MOCVD business."

AMEC's Chairman and CEO, Gerald Yin, stated: "This settlement is a good example of how competitors can resolve IP matters for the benefit of their global customer base."

As part of the settlement, all legal actions worldwide (in court, patent offices and otherwise), between Veeco, AMEC and SGL, and their affiliates, will be dismissed and/or otherwise withdrawn. As a result, all business processes, including sales, service and importation, will be continued.

Terms of the settlement were not disclosed.



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
New Plant To Manufacture Graphene Electronics
Panasonic Microelectronics Web Seminar
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
Will Future Soldiers Be Made Of Semiconductor?
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
SUSS MicroTec Opens New Production Facility In Taiwan
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
Cadence Announces $5M Endowment To Advance Research
ASML Reports €14.0 Billion Net Sales
EV Group Establishes State-of-the-art Customer Training Facility
TEL Introduces Episode UL As The Next Generation Etch Platform
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
Changes In The Management Board Of 3D-Micromac AG
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
AP&S Expands Management At Beginning Of 2021
K-Space Offers A New Accessory For Their In Situ Metrology Tools
Onto Innovation Announces New Inspection Platform
DISCO's Completion Of New Building At Nagano Works Chino Plant
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
ITRI And DuPont Inaugurate Semiconductor Materials Lab

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event