Carrier Wafers Enable Handling Of Smaller Diameter Wafers
Plan Optik AG offers Carrier Wafers which enable handling of smaller diameter wafers and a variety of substrates with different dimensions.
With increasing diameter of wafers processed in semiconductor industry not everyone can afford processing equipment or tools for different wafer diameter or even customized substrate dimensions.
Plan Optik"˜s Adapter Carriers feature pockets to hold smaller dimension substrates or wafers with smaller diameter and carry them through the process - giving you the ability to handle and process a variety of different wafer and substrate sizes - on your existing equipment.
Adapter Carriers are either mono crystalline surface processed Silicon wafers with patterned pocket(s) or Silicon wafers permanently bonded to borosilicate glass rings that have been patterned according to the dimensions of substrate. The so formed pockets on the wafer with your standard outer diameter enables processing of smaller wafers and substrates as for example 150 mm wafers on 200 mm equipment or even multiple 2" wafers on 100 mm tools.
Due to the materials used, these carriers can be used in operating temperatures up to 500Â°C (~930Â°F) max. In addition holes or grooves can be added to be able to use Plan Optik Adapter Carriers with process types as for example vacuum mounting.In order to guarantee the highest quality, Plan Optik employs a quality management system certified as per IATF 16949, ISO 14001 and ISO 9001.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
and will feature online
versions of the market-leading physical events: CS International
and PIC International
PLUS a brand new Silicon Semiconductor International
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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