Shin-Etsu Silicones One-component CLG Gap Filler
To provide progressive options to thermal engineers in the growing electronics cooling market sector for silicone TIM (Thermal Interface Materials), Shin-Etsu Silicones of America, Inc. recently premiered its CLG Series single-component, pre-cured Gap Filler product line.
SESA believe the CLG Series materials are ideal for a broad base of general electronics cooling applications–offering a wide range of thermal conductivity.
The one-component CLG Gap Filler greases are simpler to use, requiring no mixing or use of a two-part meter-mix equipment system. Notably, the material does not need to cure after it is dispensed so there is no time-consuming waiting or heating involved to cure after dispensing–and no resulting curing process by-products. The materials offer a low volatile content with excellent resistance to pump-out and creeping.
Featuring a gel-like consistency, the material is applicable on a myriad of surface shapes–easily filling voids between heat sources and heat sinks. By displacing the air from these nooks-and-crannies, a lower thermal resistance is achieved. Notably, the CLG Gap Filler material can be applied only where you need it, thereby minimizing waste. The materials can also be reworked because they do not adhere to substrates. The soft material’s low hardness minimizes stress on delicate electronic components. Additionally, the viscosity allows for ease of dispensing, reduced process times, and there are no unique storage requirements.
According to SESA’s Thermal Interface Materials Business Development Manager, Geoff Thyrum, “As electronic devices shrink in size and expand in functionality, the requirements for thermal solutions are ever-increasing. The CLG Series’ economical pre-cured and performance advantages will allow us to optimize new and existing client applications in the growing electronics cooling market segments."