Samsung And Qualcomm Expand Cooperation On EUV Process
Samsung Electronics and Qualcomm Technologies have announced the intention to expand their decade-long
foundry relationship into EUV (extreme ultra violet) lithography process technology,
including the manufacture of future Qualcomm Snapdragon 5G mobile chipsets
using Samsung's 7-nanometer (nm) LPP (Low Power Plus) EUV process technology.
Using 7LPP EUV process technology, Snapdragon 5G mobile
chipsets will offer a smaller chip footprint, giving OEMs more usable space
inside upcoming products to support larger batteries or slimmer designs.
Process improvements, combined with a more advanced chip design, are expected
to bring significant improvements in battery life.
Last May, Samsung introduced 7LPP EUV, its first
semiconductor process technology to use an EUV lithography solution. It is
anticipated that EUV lithography deployment will break the barriers of Moore's
law scaling, paving the way for single nanometer semiconductor technology
Compared with its 10nm FinFET predecessors, Samsung's 7LPP
EUV technology not only greatly reduces the process complexity with fewer
process steps and better yield, but also allows up to a 40 percent increase in
area efficiency with 10 percent higher performance or up to 35 percent lower
"We are excited to lead the 5G mobile industry together with
Samsung," said RK Chunduru, senior vice president, supply chain and
procurement, Qualcomm Technologies, Inc. "Using 7nm LPP EUV, our new generation
of Snapdragon 5G mobile chipsets will take advantage of the process
improvements and advanced chip design to improve the user experience of future
"We are pleased to continue to expand our foundry
relationship with Qualcomm Technologies in 5G technologies using our EUV
process technology," said Charlie Bae, Executive Vice President of Foundry
Sales and Marketing Team at Samsung Electronics. "This collaboration is an
important milestone for our foundry business as it signifies confidence in
Samsung's leading process technology."