Info
Info
News Article

Dream Chip ADAS SoC Shows Power Promise

News

Dream Chip Technologies has announced record power efficiency of its ADAS System-on-Chip (SoC) for automotive computer vision applications, fabricated on GLOBALFOUNDRIES's 22FDX semiconductor process at the foundry's Fab 1 facility in Dresden, Germany.

The SoC was created in close cooperation with Arm, ArterisIP, Cadence, GLOBALFOUNDRIES, and INVECAS as part of the European Commission's ENIAC THINGS2DO reference development platform, where about 40 partners in Europe cooperated to propel the FDSOI-Design Ecosystem. The chip offers high performance image acquisition and processing capabilities and supports AI / Neural Network (NN) vision operation with a total of 1 TOPS at 500 MHz on 4 parallel engines. With all functions including quad-core Arm Cortex-A53, Tensilica DSPs, and LPDDR4-Interfaces activated, the SoC shows single digit power dissipation without the need for forced cooling, which is of significant importance for embedding in automotive environments.

The SoC incorporates Dream Chip Technologies' image signal processing pipeline, working in conjunction with Cadence Tensilica Vision P6 DSPs and a quad-core cluster of Arm Cortex-A53 processors. In addition, a lock-step pair of Arm Cortex-R5 processors provides functional safety and the SoC is interconnected with an ArterisIP FlexNoC network-on-chip. Memory bandwidth is provided by a dual-channel LPDDR4-interface from INVECAS. 2 DDR-memory-chips and the SoC are mounted together on a chip-carrier, so that the module is providing 4 GigaBytes in total system memory.

The System Module is the centre piece of a new ADAS platform from Dream Chip Technologies targeted at automotive applications with a need for cost, performance and low power for embedding into the car without the need for forced cooling, such as fan or liquid. It is targeted to take over the central image recognition and manipulation tasks, based on camera capture and due to its tiny power footprint is geared to be integrated with the camera module.

Dream Chip Technologies is part of GLOBALFOUNDRIES's FDXcelerator Partner Program and supports the European automotive industry with design and engineering services. Dr. Jens Benndorf, Managing Director and Co-Founder of Dream Chip Technologies said: "Being able to collaborate with Arm, ArterisIP, Cadence, GLOBALFOUNDRIES and INVECAS and getting very early access to the 22FDX technology and the IP cores was an exciting experience and a tremendous benefit for Dream Chip Technologies, as we were able to drive Computer Vision MPSoC design in Europe to the next level. We have received an excellent technical support from these companies while meeting very aggressive schedule constraints. The power consumption we measured on the silicon have fully met the expectations and the result is highly competitive for the ADAS Computer Vision MPSoC market."

Of particular importance is the new and reduced power footprint of this SoC in 22FDX-Technology from GLOBALFOUNDRIES. AI/NN-operation for image recognition is available today, but most of the solutions need active cooling. Implementation of Dream Chip Technologies' SoC on GLOBALFOUNDRIES's 22FDX platform demonstrated single digit (1.0) Watt and cooling targets for designers managing power dissipation. If needed, the SoC bears the potential to increase the performance even further up to 2 TOPS at 1.0 GHz by applying GLOBALFOUNDRIES's forward body-bias capabilities and other optimization techniques.

"Building the best power efficiency and machine learning performances with a fully integrated SoC chip will pave the way for self-driving cars and accelerate ADAS adoption," said Sanjay Charagulla, Senior Director - Vertical Market Segments, CMOS BU of GLOBALFOUNDRIES.

Professor Blume, Head of Architectures and Systems Group of the Leibniz University of Hannover, Germany, states: "This SoC ranges among the most power efficient chips for AI. We have run implementations; code optimizations and benchmarks and we are amazed of the effectiveness of the Tensilica Vision P6-engines in this SoC architecture for image recognition and other image transformations. One TOPS on a chip without fan is very impressive."



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
New Plant To Manufacture Graphene Electronics
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
Will Future Soldiers Be Made Of Semiconductor?
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
ITRI And DuPont Inaugurate Semiconductor Materials Lab
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
TEL Introduces Episode UL As The Next Generation Etch Platform
DISCO's Completion Of New Building At Nagano Works Chino Plant
Onto Innovation Announces New Inspection Platform
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
Changes In The Management Board Of 3D-Micromac AG
ASML Reports €14.0 Billion Net Sales
AP&S Expands Management At Beginning Of 2021
Panasonic Microelectronics Web Seminar
EV Group Establishes State-of-the-art Customer Training Facility
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
Cadence Announces $5M Endowment To Advance Research
K-Space Offers A New Accessory For Their In Situ Metrology Tools
SUSS MicroTec Opens New Production Facility In Taiwan
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event