Info
Info
Info

EV Group, IBM Agree To License Laser Debonding Tech

News

EV Group's laser debonding modules incorporate a solid-state laser and proprietary beam-shaping optics designed to enable optimized, force-free debonding. The modules are designed for integration in the company's benchmark EVG®850DB automated debonding system.

EV Group (EVG) and IBM have announced that the companies intend to sign a license agreement concerning laser debonding technology. EVG plans to integrate IBM's patented Hybrid Laser Release process into EVG's advanced, field-proven temporary bonding and debonding equipment solutions, which can provide high-volume manufacturers with greater flexibility to implement optimized temporary bonding and debonding process flows. Thanks to the added process variants from IBM that will be supported by EVG's equipment portfolio, customers can choose from a wide range of bonding, cleaning and metrology process options to help address their temporary bonding and debonding requirements and applications.

The resultant advanced laser debonding solution is to be based on EVG's combination of the technology licensed from IBM with EVG's know-how. This solution is expected to encompass methods and designs for UV and IR laser debonding (designed to enable the use of glass or silicon carriers) as well as inspection of the bond interfaces. The technologies contributed by IBM help EVG implement designs that address the industry's critical requirements for temporary bonding and debonding, including high throughput, low wafer stress for high yield, and low cost of ownership of the laser equipment, processing and consumables. The advanced EVG solution encompasses techniques to help protect chips from heat and laser damage, as well as chemical clean technologies for device and carrier wafers.

Designed for integration in the company's benchmark EVG 850DB automated debonding system, EVG's laser debonding modules incorporate a solid-state laser and proprietary beam-shaping optics designed to enable optimized, force-free debonding. Featuring both low-temperature debonding and high-temperature-processing stability, EVG's laser debonding solution is available for a variety of applications. These include fan-out wafer-level packaging (FO-WLP) and other temperature-sensitive processes such as memory stacking and integration, die-partitioning, heterogeneous integration and bio-technology / organic packages and devices applications, as well as photonics, compound semiconductors and power devices.


Info
Your First Name
Your Email Address
Next »Close
 
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Magazine, the Silicon Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info