Info
Info
News Article

Plasma-Therm Wins Five Industry Awards

News

Company earns high scores in VLSIresearch's annual customer satisfaction survey of semiconductor manufacturers

Plasma-Therm has announced that for the 20th year a survey by VLSIresearch, a semiconductor supply chain market research and analysis company, has resulted in it winning multiple awards for its systems and customer service.

In VLSIresearch's annual Customer Satisfaction Survey, Plasma-Therm earned five awards, including two "˜ranked first' awards. Plasma-Therm also earned the highest scores of all companies in two award categories, "˜Etch & Clean Equipment' and "˜Focused Suppliers of Chip Making Equipment'.

Survey participants are asked to rate semiconductor equipment suppliers in 15 categories based on supplier performance, customer service, and product performance.

"The achievement of two 'ranked first' awards and five awards overall is very gratifying" Plasma-Therm CEO Abdul Lateef said. "While we continue to expand our product and application portfolio, we never lose our focus on providing the best service and support. We are working harder than ever to ensure success for all our customers, from small institutions and start-ups to specialty fabs and high-volume manufacturers."

In category of "˜The Best Suppliers of Fab Equipment', which includes specialised manufacturers like Plasma-Therm as well as the world's largest equipment makers, Plasma-Therm ranked higher than every other company besides ASML, the world's largest maker photolithography supplier. Plasma-Therm also was ranked higher than all other suppliers besides ASML in 'The Best Suppliers of Fab Equipment to Specialty Chip Makers'.

With this year's awards, Plasma-Therm says it has now received a total of 42 awards over 20 years of participation in the Customer Satisfaction Survey. VLSIresearch received feedback from more than 94 percent of the chip market in this year's survey, which was conducted over 2-1/2 months and in five languages.

ALD Is Taking Off In More-than-Moore Applications
Edwards Launches New Cryopump
CEA-Leti Unveils Navigation-Grade Gyroscopes
CEA-Leti Breakthrough For Next-Generation Memories And RRAM Energy-Storage
Are You Facing Decisions And Challenges With Interconnects, Pattern Transfer, 3D Scaling And Atomic Scale Processing And Integration?
EV GROUP Brings High-speed High-precision Metrology To 3D Heterogeneous Integration
Mycronic Receives Order For An SLX Mask Writer
Brewer Science Presents Best Practices For Workplace Culture At SEMICON West
Imec Demonstrates Significant Performance Gains Utilizing Backside 3D SOC Interconnects
SiLC Rolls Out Chip-Integrated FMCW LiDAR Sensor
NTU Singapore Launches Quantum Science And Engineering Centre
ULVAC Expands Process Capability
Brewer Science’s Newly Launched Smart Devices Will Be Displayed At CES
Park Systems Combines AFM With White Light Interferometry
YES Partners With Osiris For Edge Film Removal Technology
3D-Micromac AG Appoints Hartmut Schubert To Chief Technology Officer
Detecting And Classifying Defects In Semiconductor Manufacturing Via Atomic Force Microscopy
Kurt J. Lesker Acquires KDF Electronics & Vacuum Services
SUSS MicroTec And SET To Develop Equipment Solution For 3D Chip Integration
ERS Electronic Appoints Mark Wachter As Chief Financial Officer
Siemens Collaborates With PDF Solutions To Boost IC Yield And Speed Time
BASF And Entegris Sign Agreement On Sale
3D-Micromac AG Appoints Marko Gerlach Chief Financial Officer
The All-round Smart Proximity Sensor Chip

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
Live Event