Info
Info
News Article

Next-Generation Security-on-a-Chip For Smart Things, From STMicroelectronics

News

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has brought together the latest digital security techniques in a single chip to protect Smart Things and Networks including those for utility infrastructure against cyber threats.

Focused on providing state-of-the-art security for connected objects, the STSAFE-J100 gives the object an unalterable identity that can be authenticated; it also handles encrypted communications and provides secure storage. It is easily integrated in IoT (Internet of Things) devices like smart meters, data concentrators, and utility gateways. Customizable with market-specific applets, the STSAFE-J100 secure element combines CC EAL5+[1] certified hardware and a CC EAL5+ certified secure operating system. Device designers can take advantage of the freedom to create their own security profiles, or get to market faster using ST's pre-certified profiles such as German BSI and French Enedis smart-utilities specifications.

The STSAFE-J100 extends ST's successful track record in robust, user-friendly, hardware-digital security for e-government, transportation, banking, and consumer projects, with over 1 billion embedded secure elements delivered yearly to protect devices and networks worldwide.

"Today's on-line services and connection to remote objects need a high level of protection against ever-evolving cyber threats. It is crucial to offer device makers state-of-the-art security for a minimum integration effort," said Laurent Degauque, Marketing Director, Secure Microcontroller Division, STMicroelectronics. "The flexible STSAFE-J100 solution raises the bar with extra performance and support for the latest encryption algorithms and security standards, including security profiles for the important German and French smart-metering markets."

To help customers take full advantage of the flexibility of the STSAFE-J100 and ensure uncompromising threat protection, ST provides secure device-personalization service. Personalizing each device with its unique identity and cryptographic keys is a fundamental part of the secure-element philosophy to create trusted hardware resistant to cloning or hacking. ST's service is safe and cost-effective, and relieves customers of responsibility for secure programming, preventing exposure of keys and secrets, and distributing programmed devices.

The STSAFE-J100 occupies minimal real-estate on the main system board, in either a 5mm x 5mm VFQFPN32, 6.0mm x 4.9mm SO8N, or 4.2mm x 4.0mm UDFN8 package. Please contact your local ST sales office for pricing options and sample requests.



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
AP&S Expands Management At Beginning Of 2021
Panasonic Microelectronics Web Seminar
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
New Plant To Manufacture Graphene Electronics
Cadence Announces $5M Endowment To Advance Research
DISCO's Completion Of New Building At Nagano Works Chino Plant
EV Group Establishes State-of-the-art Customer Training Facility
ASML Reports €14.0 Billion Net Sales
Changes In The Management Board Of 3D-Micromac AG
Onto Innovation Announces New Inspection Platform
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
TEL Introduces Episode UL As The Next Generation Etch Platform
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
ITRI And DuPont Inaugurate Semiconductor Materials Lab
SUSS MicroTec Opens New Production Facility In Taiwan
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
K-Space Offers A New Accessory For Their In Situ Metrology Tools
Will Future Soldiers Be Made Of Semiconductor?
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event