+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

New device to enhance airport security cameras

News

Picture Credit: Australian National University (ANU)

A team of scientists led by the Australian National University (ANU) has invented a new device with advanced sensing functions that can help improve airport security. Produced using ultra-compact structures known as metasurfaces, the device is capable of controlling the direction of electromagnetic waves.

The new device can be equipped to airport security cameras to expedite passenger processing at airports and help reduce waiting times.

Lead researcher at the ANU’s Research School of Physics and Engineering Nonlinear Physics Centre Dr Mingkai Liu said: “This device can sense the entire environment surrounding it with unprecedented precision. Previously, multiple fixed sensors pointing towards different directions would be required to achieve this.

“These future cameras could identify hazardous devices or dangerous chemicals in people’s carry-on baggage when they walk through an airport without needing them to queue up and go through the various procedures that are necessary now.”

The research has already led to a proof-of-concept prototype device and provisional patent.

As well as applications in airport security, the new concept can be used to develop compact sensors for driverless cars and other vehicles to help overcome safety challenges. The research team will continue to develop the device so that it is ready to be commercialised and manufactured on a larger scale.

A team of researchers from the School of Engineering and Information Technology at the University of New South Wales, Canberra, were also involved in the project.

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: