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Naprotek Installs Flexible New MXI System

Naprotek, a provider of electronic manufacturing services, has
announced that it has purchased and successfully installed the Quadra 5
flexible X-ray inspection solution from Nordson DAGE, a division of Nordson.
With the new Nordson DAGE Quadra 5, Naprotek will benefit from industry-leading
core technology, high performance and ease of use for 2D and 3D X-ray
applications.

“Naprotek is constantly investing in the latest technology
to enhance our capabilities while providing the highest level of service to our
customers,” said Larry Morrissey, Vice President Operations at Naprotek. “Our
investment in the Nordson DAGE Quadra 5 2.5D X-ray system gives us
state-of-the-art technology and significantly better diagnostic tools resulting
in higher overall quality.”

0.35μm feature recognition up to 20 W of power, makes the
Quadra 5 the leading choice for PCB and semiconductor package inspection. Key
features include:

< 0.35µm
(350nm) Feature Recognition up to 20 W Tube power

Aspire FP 3 MP @
25fps with 50µm pixel pitch

Total
Magnification 45,000 X

24″ Full HD WUXGA
1920 x 1200 Primary LED monitor

70° Oblique Views
Without Loss of Magnification.



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Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

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Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

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VIEW SESSIONS
SUSS MicroTec Opens New Production Facility In Taiwan
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
Will Future Soldiers Be Made Of Semiconductor?
ITRI And DuPont Inaugurate Semiconductor Materials Lab
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
Changes In The Management Board Of 3D-Micromac AG
DISCO's Completion Of New Building At Nagano Works Chino Plant
TEL Introduces Episode UL As The Next Generation Etch Platform
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
EV Group Establishes State-of-the-art Customer Training Facility
New Plant To Manufacture Graphene Electronics
AP&S Expands Management At Beginning Of 2021
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
K-Space Offers A New Accessory For Their In Situ Metrology Tools
Panasonic Microelectronics Web Seminar
Onto Innovation Announces New Inspection Platform
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
ASML Reports €14.0 Billion Net Sales
Cadence Announces $5M Endowment To Advance Research
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European

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