Naprotek Installs Flexible New MXI System
Naprotek, a provider of electronic manufacturing services, has
announced that it has purchased and successfully installed the Quadra 5
flexible X-ray inspection solution from Nordson DAGE, a division of Nordson.
With the new Nordson DAGE Quadra 5, Naprotek will benefit from industry-leading
core technology, high performance and ease of use for 2D and 3D X-ray
“Naprotek is constantly investing in the latest technology
to enhance our capabilities while providing the highest level of service to our
customers,” said Larry Morrissey, Vice President Operations at Naprotek. “Our
investment in the Nordson DAGE Quadra 5 2.5D X-ray system gives us
state-of-the-art technology and significantly better diagnostic tools resulting
in higher overall quality.”
0.35μm feature recognition up to 20 W of power, makes the
Quadra 5 the leading choice for PCB and semiconductor package inspection. Key
(350nm) Feature Recognition up to 20 W Tube power
Aspire FP 3 MP @
25fps with 50µm pixel pitch
Magnification 45,000 X
24″ Full HD WUXGA
1920 x 1200 Primary LED monitor
70° Oblique Views
Without Loss of Magnification.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
and will feature online
versions of the market-leading physical events: CS International
and PIC International
PLUS a brand new Silicon Semiconductor International
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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